Specifications

PRODUCTS
Hybrid IC
TYPE
BP35C5
PAGE
29/33
21. Product Weight
1.4 gram
22. Manufacturing Country
China
23. Precautions for Use
1) This product allows the reflow process only once.
(with ROHM’s recommended reflow condition)
During the reflow process, the solder inside the product may be re-fused or re-melt.
Please note this and pay special attention.
2) If this product is laid neglected, it will absorb moisture from the surrounding environment.
Keep this Product with below mentioned condition, and reflow mount it within 72 hours of opening the
laminated bag.
<Store condition>
Temperature: 5 °C～40 °C
Relative Humidity: 50±10 %RH
3) If storage in the desiccator where is humidity under the recommended values, be sure to protect this
product from static electricity.
4) Be sure to use after baking process with the following conditions when it passed 72 hours after opening;
・Baking condition: 125 °C / 24 hours (Not in reel state), Baking times: up to once
5) When a mounter is used to place this product, its recognition should be taken with the reverse side (pad)
of product. It is not recommended to use the dimensions of product for recognition as its tolerance is big.
6) There are cases where lot numbers are different in the same reel.
7) There are cases where serial numbers (MAC address) are not in sequence in the same reel.
8) About soldering parts of mounting on this product, presence of soldering fillet does not be asked.
9) With respect to a label affixed to this product, defects other than “peeling”, “sticking-out”, and “extreme
defect in character recognition” are overlooked.
10) This product is assumed to be mounted on glass epoxy board.
If the product is mounted on other materials board such as ceramic, be sure to evaluate it sufficiently.
11) RF-SW (pin 27, pin 29 ANT terminal) which is mounted inside the module is a product very weak to
static electricity on the specification. Be sure to use after taking sufficient measures against static
electricity.
12) Please note that it is likely to come off when the stress joins the shield case.
13) Use this product without cleaning residue of flux.
14) About wireless communication
1. Wireless communication may be unstable due to radio wave environment and
communication environment, does not guarantee 100 % data transfer, ROHM assumes
absolutely no responsibility even if data is missing.
2. UDP does not provide for the arrival of consecutive packet send data arrival is not
guaranteed.
3. Please fully verify with customers before installing this product in customer's set and
doing full-scale operation.
4. ROHM assumes no responsibility for any damage or malfunction caused by data
interception, loss, theft, leakage to a third party.
REV. E
SPECIFICATION No.: TARGET SPECIFICATION
TSZ22111･05･002