Datasheet

Technical Note
30/31
BD5446EFV
www.rohm.com
2011.06 - Rev.C
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●Allowable Power Dissipation
Measuring instrument : TH-156(Shibukawa Kuwano Electrical Instruments Co., Ltd.)
Measuring conditions : Installation on ROHM’s board
Board size : 70mm×70mm×1.6mm(with thermal via on board)
Material : FR4
・The board on exposed heat sink on the back of package are connected by soldering.
PCB① : 1-layer board(back copper foil size: 0mm×0mm), θja＝62.5℃/W
PCB② : 2-layer board(back copper foil size: 70mm×70mm),θja＝27.8℃/W
PCB③ : 4-layer board(back copper foil size: 70mm×70mm),θja＝20.2℃/W
0
1
2
3
4
5
6
7
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Ambient Temperature:Ta(
℃
)
Power Dissipation Pd （W)
PCB③ 6.2W
PCB② 4.5W
PCB① 2.0W