Specifications

Publication 1747-SG001E-EN-E - February 2013
System Overview 5
SLC 500 processors are single-slot modules that you place into the left-most slot of a
1746 I/O chassis. For I/O in a location remote from the processor, the I/O adapter is a
single-slot module that you place in the left-most slot of the I/O chassis. SLC 500
modular systems provide separate power supplies which must be mounted directly on the
left end of the 1746 I/O chassis.
The 1746 I/O chassis are designed for back-panel mounting and available in sizes of 4, 7,
10, or 13 module slots. The 1746 I/O modules are available in densities up to a maximum
of 32 channels per module.
Communications
Evaluate what communications need to occur. Knowing your communications
requirements will help you determine which processor and which communications
devices your application might require.
An SLC processor communicates across the 1746 backplane to 1746 I/O modules in the
same chassis in which the processor resides. Various models of SLC processors have
various on-board ports for communication with other processors or computers. Also,
separate modules are available to provide additional communication ports for
communication with other processors, computers, and remotely located I/O.
Each processor has one or two built-in ports for either EtherNet/IP, DH+, DH-485, or
RS-232 (DF1, ASCII, or DH-485 protocol) communication.
In addition to the on-board ports available with SLC processors, you have the option of
providing another communication port for an SLC processor by adding a
communication module.
Adapter modules for 1746 I/O are available for ControlNet and Universal Remote I/O
links. An I/O adapter module in a chassis with I/O modules interfaces the I/O modules
with the I/O link for communication with a scanner port for a processor at another
location.
SLC 500 Common
Specifications
The following specifications apply to all SLC 500 modular components unless noted.
Environmental Specifications
Attribute Value
Temperature, operating IEC 60068-2-1 (Test Ad, Operating Cold),
IEC 60068-2-2 (Test Bd, Operating Dry Heat),
IEC 60068-2-14 (Test Nb, Operating Thermal Shock):
0…60 °C (32…140 °F)
Temperature, nonoperating IEC 60068-2-1 (Test Ab, Unpackaged Nonoperating Cold),
IEC 60068-2-2 (Test Bb, Unpackaged Nonoperating Dry Heat),
IEC 60068-2-14 (Test Na, Unpackaged Nonoperating Thermal Shock):
-40…85 °C (-40…185 °F)
Relative humidity IEC 60068-2-30 (Test Db, Unpackaged Damp Heat):
5…95% without condensation