User manual
Placing System Hardware
Chapter 3
3-2
To allow for proper convection cooling in enclosures containing a
processor-resident chassis and remote I/O chassis, follow these guidelines.
Area reserved for disconnect.
transformer, control relays, motor
starters or other user devices.
13081
Minimum spacing requirements for a
processorresident chassis:
• Mount the I/O chassis horizontally.
• Allow 153 mm (6 in) above and below the chassis.
• Allow 102 mm (4 in) on the sides of each chassis.
• Allow 51 mm (2 in) vertically and horizontally between
any chassis and the wiring duct or terminal strips.
• Leave any excess space at the top of the enclosure,
where the temperature is the highest.
102mm
(4")
153mm
(6")
51mm
(2")
102mm
(4")
Wiring Duct
153mm
(6")
51mm(2")