User Manual
Table Of Contents
- 1771-6.5.88, Plastic Molding Module Reference Manual
- Summary of Changes
- Table of Contents
- Preface
- 1 - Abbreviated Command and Status Blocks
- Chapter Contents
- CLC - Clamp and Eject ERC Values Block
- CPC - Clamp Close Profile Block
- DYC - Dynamic Command Block
- EAC - Ejector Advance Configuration Block
- EPC - Ejector Profile Block
- ERC - Ejector Retract Configuration Block
- FCC - First Clamp Close Configuration Block
- FOC - First Clamp Open Configuration Block
- HDC - Hold Configuration Block
- HPC - Pack/Hold Profile Block
- INC - Injection Configuration Block
- IPC - Injection Profile Block
- JGC - Jog Configuration Block
- LPC - Clamp Low Pressure Close Configuration Block
- MCC - Module Configuration Command Block
- OPC - Clamp Open Profile Block
- OSC - Clamp Open Slow Configuration Block
- PKC - Pack Configuration Block
- PLC - Plastication Configuration Block
- PPC - Plastication Profile Block
- PRC - Pre-decompression Configuration Block
- PSC - Post- decompression Configuration Block
- PTC - Process Trace Configuration Block
- RLC - Inject ERC Values Block
- SCC - Second Clamp Close Configuration Block
- SOC - Second Clamp Open Configuration Block
- TCC - Third Clamp Close Configuration Block
- TOC - Third Clamp Open Configuration Block
- CLS - Clamp and Eject ERC Values Status Block
- CPS - Clamp Close Profiles Status Block
- EPS - Ejector Profile Status Block
- HPS - Pack/Hold Profile Status Block
- IPS - Injection Profile Status Block
- OPS - Clamp Open Profiles Status Block
- PPS - Plastication Profile Status Block
- PTS - Process Trace Status Block
- RLS - Inject ERC Values Status Block
- SYS - System Status Block
- 2 - Command Word/Bit Descriptions
- Alphabetical List of Command Blocks and Block ID Codes
- List of Data Words
- Engineering Units
- Data Blocks Require I/O Configuration
- Data Blocks for System Control
- Data Blocks for Controlling Ram (Screw) Position
- Data Blocks for Controlling Clamp Position
- Data Blocks for Controlling Ejector Position
- Sensors Required
- CLC CLC - Clamp and Eject ERC Values Block
- CPC - Clamp Close Profile Block
- DYC DYC - Dynamic Command Block
- EAC - Ejector Advance Configuration Block
- EPC - Ejector Profile Block
- ERC - Ejector Retract Configuration Block
- FCC - First Clamp Close Configuration Block
- FOC - First Clamp Open Configuration Block
- HDC - Hold Configuration Block
- HPC - Pack/Hold Profile Block
- INC - Injection Configuration Block
- IPC - Injection Profile Block
- JGC - Jog Configuration Block
- LPC - Clamp Low Pressure Close Configuration Block
- MCC - Module Configuration Command Block
- OPC - Clamp Open Profile Block
- OSC - Clamp Open Slow Configuration Block
- PKC - Pack Configuration Block
- PLC Plastication Configuration Command Block (PLC)
- PPC - Plastication Profile Block
- PRC - Pre-decompression Configuration Block
- PSC - Post-decompression Configuration Block
- PTC - Process Trace Configuration Block
- RLC - Inject ERC Values Block
- SCC - Second Clamp Close Configuration Block
- SOC - Second Clamp Open Configuration Block
- TCC - Third Clamp Close Configuration Block
- TOC - Third Clamp Open Configuration Block
- 3 - Word/Bit Descriptions
- List of Status Blocks and Block ID Codes
- List of Data Words
- Data Blocks Require I/O Configuration
- Engineering Units
- Status Block for Reporting System Status
- Status Blocks for Reporting Ram (Screw) Position
- Status Blocks for Reporting Clamp Position
- Status Blocks for Reporting Ejector Position
- CLS - Clamp and Eject ERC Values Status Block
- CPS - Clamp Close Profiles Status Block
- EPS - Ejector Profile Status Block
- HPS - Pack/Hold Profile Status Block
- IPS ú Injection Profile Status Block
- OPS - Clamp Open Profiles Status Block
- PPS - Plastication Profile Status Block
- PTS - Process Trace Status Block
- RLS - Inject ERC Values Status Block
- SYS - System Status Block
- 4 - Programming Error Codes
- 5 - Module Specifications
- 6 - Calibration Instructions
- A - Single transfer for Reporting Ejector Status
- Back cover

Chapter 5
Publication
1771-6.5.88 – July 1997
Module Specifications
This chapter gives 1771-QDC module specifications including:
• I/O specifications
• environmental conditions
• hardware requirements
• process control options
The following table lists the I/O specifications.
Inputs 4 analog (4-20 mA, 1 to +5V dc, 0 to +10V dc selectable)
Outputs 4 analog (4-20 mA, 0 to +10V dc, –10 to +10V dc selectable)
I/O Resolution 12-bit binary
I/O Isolation 1500V rms between chassis and swingarm terminals, and
between input and output terminals
I/O Accuracy
(linearity, gain, and offset)
0.1% full scale @ 25
o
C, and +/–50ppm/
o
C of full scale range
Input Impedance Voltage Input: 50K ohms, differential mode
25K ohms, common mode
Current Input: 250 ohms
Loss of Input Detection Detects loss of position, pressure, and RPM input sensors:
out of range 4-20 mA sensors
out of range 1-5V dc sensors
out of range 0-10V dc sensors
Output Loading Voltage: 5 mA max for any range
Current: 15V dc compliance
(supports a max current-loop impedance of 750
ohms)
Output Overload
Protection
Protects against short circuit for one minute, maximum
The following table lists environmental conditions.
Operational Temperature 0 to 85
o
C (32 to 140
o
F)
Thermal Dissipation 21 BTU/hr (outputs full ON)
Storage Temperature –40 to +85
o
C (–40 to +140
o
F)
Relative Humidity 5 to 95% (without condensation)
The following table lists the hardware requirements.
Compatible I/O Chassis Allen-Bradley Series B
Slot Size Any single I/O slot in 1771-I/O chassis
Power Requirements (Backplane) 1.2 amps at 5V dc
Swingarm Style 1771-WF
Keying Bands Between: 20-22
and 26-28
I/O Specifications
Environmental Conditions
Hardware Requirements