User Manual
Table Of Contents
- 1771-6.5.88, Plastic Molding Module Reference Manual
- Summary of Changes
- Table of Contents
- Preface
- 1 - Abbreviated Command and Status Blocks
- Chapter Contents
- CLC - Clamp and Eject ERC Values Block
- CPC - Clamp Close Profile Block
- DYC - Dynamic Command Block
- EAC - Ejector Advance Configuration Block
- EPC - Ejector Profile Block
- ERC - Ejector Retract Configuration Block
- FCC - First Clamp Close Configuration Block
- FOC - First Clamp Open Configuration Block
- HDC - Hold Configuration Block
- HPC - Pack/Hold Profile Block
- INC - Injection Configuration Block
- IPC - Injection Profile Block
- JGC - Jog Configuration Block
- LPC - Clamp Low Pressure Close Configuration Block
- MCC - Module Configuration Command Block
- OPC - Clamp Open Profile Block
- OSC - Clamp Open Slow Configuration Block
- PKC - Pack Configuration Block
- PLC - Plastication Configuration Block
- PPC - Plastication Profile Block
- PRC - Pre-decompression Configuration Block
- PSC - Post- decompression Configuration Block
- PTC - Process Trace Configuration Block
- RLC - Inject ERC Values Block
- SCC - Second Clamp Close Configuration Block
- SOC - Second Clamp Open Configuration Block
- TCC - Third Clamp Close Configuration Block
- TOC - Third Clamp Open Configuration Block
- CLS - Clamp and Eject ERC Values Status Block
- CPS - Clamp Close Profiles Status Block
- EPS - Ejector Profile Status Block
- HPS - Pack/Hold Profile Status Block
- IPS - Injection Profile Status Block
- OPS - Clamp Open Profiles Status Block
- PPS - Plastication Profile Status Block
- PTS - Process Trace Status Block
- RLS - Inject ERC Values Status Block
- SYS - System Status Block
- 2 - Command Word/Bit Descriptions
- Alphabetical List of Command Blocks and Block ID Codes
- List of Data Words
- Engineering Units
- Data Blocks Require I/O Configuration
- Data Blocks for System Control
- Data Blocks for Controlling Ram (Screw) Position
- Data Blocks for Controlling Clamp Position
- Data Blocks for Controlling Ejector Position
- Sensors Required
- CLC CLC - Clamp and Eject ERC Values Block
- CPC - Clamp Close Profile Block
- DYC DYC - Dynamic Command Block
- EAC - Ejector Advance Configuration Block
- EPC - Ejector Profile Block
- ERC - Ejector Retract Configuration Block
- FCC - First Clamp Close Configuration Block
- FOC - First Clamp Open Configuration Block
- HDC - Hold Configuration Block
- HPC - Pack/Hold Profile Block
- INC - Injection Configuration Block
- IPC - Injection Profile Block
- JGC - Jog Configuration Block
- LPC - Clamp Low Pressure Close Configuration Block
- MCC - Module Configuration Command Block
- OPC - Clamp Open Profile Block
- OSC - Clamp Open Slow Configuration Block
- PKC - Pack Configuration Block
- PLC Plastication Configuration Command Block (PLC)
- PPC - Plastication Profile Block
- PRC - Pre-decompression Configuration Block
- PSC - Post-decompression Configuration Block
- PTC - Process Trace Configuration Block
- RLC - Inject ERC Values Block
- SCC - Second Clamp Close Configuration Block
- SOC - Second Clamp Open Configuration Block
- TCC - Third Clamp Close Configuration Block
- TOC - Third Clamp Open Configuration Block
- 3 - Word/Bit Descriptions
- List of Status Blocks and Block ID Codes
- List of Data Words
- Data Blocks Require I/O Configuration
- Engineering Units
- Status Block for Reporting System Status
- Status Blocks for Reporting Ram (Screw) Position
- Status Blocks for Reporting Clamp Position
- Status Blocks for Reporting Ejector Position
- CLS - Clamp and Eject ERC Values Status Block
- CPS - Clamp Close Profiles Status Block
- EPS - Ejector Profile Status Block
- HPS - Pack/Hold Profile Status Block
- IPS ú Injection Profile Status Block
- OPS - Clamp Open Profiles Status Block
- PPS - Plastication Profile Status Block
- PTS - Process Trace Status Block
- RLS - Inject ERC Values Status Block
- SYS - System Status Block
- 4 - Programming Error Codes
- 5 - Module Specifications
- 6 - Calibration Instructions
- A - Single transfer for Reporting Ejector Status
- Back cover

2–52 Command Word/Bit Descriptions
Publication
1771-6.5.88 – July 1997
Notes: 1. For [ ] engineering units, see page 3.
2. When using the Inject/Clamp/Eject mode, all pressure readings are system pressure at input 2, except where noted.
Word Description
HPC13 Pack Segment 2 Ram (Screw) Pressure Setpoint [01] If you select Ram Press/Time profile execution, the module controls ram
(screw) pressure to this setpoint at completion of segment 1 for time period specified by HPC14.
HPC14 Pack Segment 2 Time Setpoint [21] The module controls the selected process pressure to the setpoint HPC12 or HPC13 for this
time period beginning at completion of Segment 1.
HPC15 Pack Segment 3 Cavity Pressure Setpoint [04] If you select Cav Press/Time profile execution, the module controls cavity pressure
to this setpoint at completion of segment 2 for time period specified by HPC17.
HPC16 Pack Segment 3 Ram (Screw) Pressure Setpoint [01] If you select Ram Press/Time profile execution, the module controls ram
(screw) pressure to this setpoint at completion of segment 2 for time period specified by HPC17.
HPC17 Pack Segment 3 Time Setpoint [21] The module controls the selected process pressure to the setpoint HPC15 or HPC16 for this
time period beginning at completion of Segment 2.
HPC18 Pack Segment 4 Cavity Pressure Setpoint [04] If you select Cav Press/Time profile execution, the module controls cavity pressure
to this setpoint at completion of segment 3 for time period specified by HPC20.
HPC19 Pack Segment 4 Ram (Screw) Pressure Setpoint [01] If you select Ram Press/Time profile execution, the module controls ram
(screw) pressure to this setpoint at completion of segment 3 for time period specified by HPC20.
HPC20 Pack Segment 4 Time Setpoint [21] The module controls the selected process pressure to the setpoint HPC18 or HPC19 for this
time period beginning at completion of Segment 3.
HPC21 Pack Segment 5 Cavity Pressure Setpoint [04] If you select Cav Press/Time profile execution, the module controls cavity pressure
to this setpoint at completion of segment 4 for time period specified by HPC23.
HPC22 Pack Segment 5 Ram (Screw) Pressure Setpoint [01] If you select Ram Press/Time profile execution, the module controls ram
(screw) pressure to this setpoint at completion of segment 4 for time period specified by HPC23.
HPC23 Pack Segment 5 Time Setpoint [21] The module controls the selected process pressure to the setpoint HPC21 or HPC22 for this
time period beginning at completion of Segment 4.
Pack Profile Offsets
Word Description
HPC24 Pack Profile Cavity Pressure Offset [04] If you select Cav Press/Time profile execution , the module applies this entry (after reading
the sign bit) to each cavity pressure profile setpoint.
HPC25 Pack Profile Ram (Screw) Pressure Offset [01] If you select Ram Press/Time profile execution, the module applies this entry (after
reading the sign bit) to each ram (screw) pressure profile setpoint.
Hold Profile Setpoints
Word Description
HPC26 Hold Segment 1 Cavity Pressure Setpoint [04] If you select Cav Press/Time profile execution, the module controls cavity pressure to
this setpoint after starting the Hold Profile for time period specified by HPC28.
HPC27 Hold Segment 1 Ram (Screw) Pressure Setpoint [01] If you select Ram Press/Time profile execution, the module controls ram
(screw) pressure to this setpoint after starting the Hold Profile for time period specified by HPC28.
HPC28 Hold Segment 1 Time Setpoint [21] The module controls the selected process pressure to the setpoint HPC26 or HPC27 for this
time period beginning with initiation of the Hold Profile.
HPC29 Hold Segment 2 Cavity Pressure Setpoint [04] If you select Cav Press/Time profile execution, the module controls cavity pressure to
this setpoint at completion of segment 1 for time period specified by HPC31.
HPC30 Hold Segment 2 Ram (Screw) Pressure Setpoint [01] If you select Ram Press/Time profile execution, the module controls ram
(screw) pressure to this setpoint at completion of segment 1 for time period specified by HPC31.
HPC31 Hold Segment 2 Time Setpoint [21] The module controls the selected process pressure to the setpoint HPC29 or HPC30 for this
time period beginning at completion of Segment 1.
HPC32 Hold Segment 3 Cavity Pressure Setpoint [04] If you select Cav Press/Time profile execution, the module controls cavity pressure to
this setpoint at completion of segment 2 for time period specified by HPC34.
HPC33 Hold Segment 3 Ram (Screw) Pressure Setpoint [01] If you select Ram Press/Time profile execution, the module controls ram
(screw) pressure to this setpoint at completion of segment 2 for time period specified by HPC34.
HPC34 Hold Segment 3 Time Setpoint [21] The module controls the selected process pressure to the setpoint HPC32 or HPC33 for this
time period beginning at completion of Segment 2.
HPC35 Hold Segment 4 Cavity Pressure Setpoint [04] If you select Cav Press/Time profile execution, the module controls cavity pressure to
this setpoint at completion of segment 3 for time period specified by HPC37.
HPC36 Hold Segment 4 Ram (Screw) Pressure Setpoint [01] If you select Ram Press/Time profile execution, the module controls ram
(screw) pressure to this setpoint at completion of segment 3 for time period specified by HPC37.