Specifications

4 Rockwell Automation Publication 1769-TD006E-EN-P - January 2015
1769 Compact I/O Modules Specifications
Place Compact I/O Modules
You can DIN-rail or panel mount the controller and I/O modules. The number of local I/O modules supported depends
on the controller.
Table 1 - Environmental Specifications - 1769 I/O Modules
Attribute 1769-IA8I, 1769-IA16, 1769-IM12, 1769-
OA8, 1769-OA16, 1769-IQ16, 1769-IQ16F,
1769-IQ32, 1769-IQ6XOW4, 1769-OB8, 1769-
OB16, 1769-OB16P, 1769-OB32, 1769-OV16,
1769-OW8, 1769-OW8I, 1769-OW16
1769-IF4, 1769-IF4XOF2, 1769-IR6, 1769-IT6
1769-ARM, 1756-HSC
1769-IG16, 1769-IQ32T, 1769-OB32T, 1769-
OG16, 1769-OV32T
1769-IF4I, 1769-IF8, 1769-IF16C, 1769-
IF16V, 1769-OF2, 1769-OF4CI, 1769-OF4VI,
1769-OF8C, 1769-OF8V, 1769-IF4FXOF2F
1769-ASCII, 1769-BOOLEAN
Temperature, operating
IEC 60068-2-1 (Test Ad, Operating Cold),
IEC 60068-2-2 (Test Bd, Operating Dry Heat),
IEC 60068-2-14 (Test Nb, Operating Thermal Shock)
0…60 °C (32…140 °F) 0…60 °C (32…140 °F)
Temperature, storage
IEC 60068-2-1 (Test Ab, Unpackaged Nonoperating Cold),
IEC 60068-2-2 (Test Bb, Unpackaged Nonoperating Dry Heat),
IEC 60068-2-14 (Test Na, Unpackaged Nonoperating Thermal Shock)
-40…85 °C (-40…185 °F) -40…85 °C (-40…185 °F)
Relative humidity
IEC 60068-2-30 (Test Db, Unpackaged Nonoperating Damp Heat)
5…95% noncondensing 5…95% noncondensing
Vibration
IEC 60068-2-6 (Test Fc, Operating)
Operating: 5 g @ 10…500 Hz
Relay operating: 2 g
5 g @ 10…500 Hz
Shock, operating
IEC 60068-2-27 (Test Ea, Unpackaged Shock)
Panel mount 30 g
DIN rail mount 20 g
Panel mount 30 g
DIN rail mount 20 g
Shock, relay operating
IEC 60068-2-27 (Test Ea, Unpackaged Shock)
Panel mount 7.5 g
DIN rail mount 5 g
—
Shock, nonoperating
IEC 60068-2-27 (Test Ea, Unpackaged Shock)
Panel mount 40 g
DIN rail mount 30 g
Panel mount 40 g
DIN rail mount 30 g
Controller Supports Location Considerations
1769-L24ER-QB1B
1769-L24ER-QBFC1B
1769-L27ERM-QBFC1B
4 local modules Right side of the controller The additional modules are connected directly to the controller. There are no
additional banks of local I/O.
1769-L30ER
1769-L30ERM
1769-L30ER-NSE
8 local modules 1 separate bank The additional banks are powered by standard 1769 power supplies and connect to
the main rack by using standard 1769 expansion cables.
1769-L33ER
1769-L33ERM
16 local modules 2 separate banks
1769-L36ERM 30 local modules 3 separate banks
1769-L23E-QB1B
1769-L23E-QBFC1B
1769-L23-QBFC1B
2 local modules, V17 and
earlier.
Right side of the packaged
controller
The additional modules are connected directly to the packaged controller. There are
no additional banks of local I/O.
1769-L23E-QB1B 3 local modules, v18 and
later.