Data Sheet

10 MDC1xxx Motor Controller Datasheet Version 1.3. January 27, 2015
Scripting
Thermal Specifications
The MDC1xxx uses a conduction plate at the bottom of the board for heat extraction. For best results, attach
firmly with thermal compound paste against a metallic chassis so that heat transfers to the conduction plate to
the chassis. If no metallic surface is available, mount the controller on spacers so that forced or natural air flow
can go over the plate surface to remove heat.
Mechanical Specifications
TABLE 7.
Parameter Measure Point Min Typ Max Units
Scripting Flash Memory Internal 8196 Bytes
Max Basic Language programs Internal 1000 Lines
Integer Variables Internal 1024 Words (1)
Boolean Variables Internal 1024 Symbols
Execution Speed Internal 50000 Lines/s
Note 1: 32-bit words
TABLE 8.
Parameter Measure Point Min Typ Max Units
Board Temperature PCB -40 85 (1) oC
Thermal Protection range PCB 70 80 (2) oC
Thermal resistance Power MOSFETs to heats sink 2 oC/W
Note 1: Thermal protection will protect the controller power
Note 2: Max allowed power out starts lowering at minimum of range, down to 0 at max of range
TABLE 9.
Parameter Measure Point Min Typ Max Units
Weight Board 100 (3.5) g (oz.)
Power Wire Gauge FASTON tabs 10 AWG
0.7" (17.8mm)
0.16" (4.0mm)
0.325" (8.3 mm)
0.25"
(6.3 mm)
0.3"
(7.6 mm)
0.57"
(14.5mm)
0.98"
(25mm)
FIGURE 7. MDC1xxx side view and dimensions