User Manual
10
DO NOT WORK ON LIVE CIRCUITS. Before working on any mains powered equipment,
Product Specication
Model
Power Voltage
Power Consumption (Max)
Pump
Temperature Range
Fuse (Fast Type)
RND 560-00159
100-120Vac 60Hz/ 220-240Vac 50Hz
1300W
Diaphragm 220V
100-500
OPERATING PRECAUTIONS
2. Caution High Temperature Operation
disconnect the plug during this cooling process.
authorized repairers for proper servicing.
5. Disconnect the plug while the unit is not in use.
unit for a longer period of time, disconnect the plug.
11
IMPORTANT: Do not force the nozzle or pull on the edge of the nozzle with pliers. Also,
do not tighten the set-screw too tightly.
Suitable for desoldering of SMD components such as SOIC, CHIP, QFP, PLCC, BGA etc.
QFP De-soldering
1. Melt the solder: Hold the iron so that the nozzle is located directly over, but not
touching the IC and allow the hot air to melt the solder. Be careful not to touch
the leads of the IC with the nozzle.
2. Remove the IC: Once the solder has melted, remove the IC by liing the pliers.
3. Turn the power switch o: Aer the power switch is o, an automatic blowing
function begins sending cool air through the pipe in order to cool both the
heating element and the handle. So do not disconnect the plug during this
cooling process.
4. In case you don’t use the unit for a long time, disconnect the plug.
Note: Aer the power switch o about one minute later, the temperature will fall
down to 750C (1670C) and power automatically shut o.
5. Remove any remaining solder: Aer removing the IC, cleaning the remaining
solder chips with a wick or desoldering tool.
Note: For SOP, PLCC etc. would recommend by using tweezers iron to desolder.
F