Datasheet

Chip NTC Thermistor
RND is a trademark of Distrelec
Reliability Test
Item
Test Methods and Remarks
Terminal
Strength
Standard
IEC 60068-2-21
Requirements
No removal or split of the
termination or other defects shall
occur
Solder the chip to the testing jig (glass epoxy board
shown in the right) using eutectic solder. Then apply a
force in the direction of the arrow.
Size
F
Duration
0402, 0603
0805
10N
5N
10 ± 1 s
Resistance
to Flexure
IEC 60068-2-21
Solder the chip to the test jig (glass epoxy board
shown in the right) using a eutectic solder. Then apply
a force in the direction shown as follow
Size
Flexure
Duration
0402, 0603
0805
2 mm
1 mm
10 ± 1 s
Pressurizing
Speed
<0.5 mm/s
1. No visible damage
2. ∣∆R25/R25∣≤5%
Size
a
c
0603
0805
1.2 mm
1 mm
b
0402
0.4 mm 1.5 mm
3 mm
4 mm
0.5 mm
1.2 mm
1.65 mm
Vibration IEC 60068-2-80
1. Solder the chip to the testing jig (glass epoxy board
shown in the left) using eutectic solder
2. The chip shall be subjected to a simple harmonic
motion having total amplitude of 1.5 mm, the
frequency being varied uniformly between the
approximate limits of 10 and 55 Hz
3. The frequency ranges from 10 to 55 Hz and return to
10 Hz shall be traversed in approximately 1 minute.
This motion shall be applied for a period of 2 hours in
each 3 mutually perpendicular directions (total of 6
hours)
No visible damage
Dropping
IEC 60068-2-32
No visible damage
Drop a chip 10 times on a concrete floor from a height
of 1 meter