Chip NTC Thermistor Features • High testing precision • Steady operating for long time • Reflow soldering possible • Short response time Applications • Temperature measurement • Battery chargers • Temperature sensing, protection and compensation in industrial, telecom and consumer applications • Inrush current limiting, e.g.
Chip NTC Thermistor Test and Measurement Procedures Unless otherwise specified, the standard atmospheric conditions for measurement/test as • Ambient Temperature: 20±15℃ • Relative Humidity: 65±20% • Air Pressure: 86 kPa to 106 kPa If any doubt on the results, measurements/tests should be made within the following limits • Ambient Temperature: 20±2℃ • Relative Humidity: 65±5% • Air Pressure: 86 kPa to 106 kPa Inspection Equipment • Visual Examination: 20x magnifier • Resistance value test: Thermistor resist
Chip NTC Thermistor Reliability Test Item Terminal Strength Standard IEC 60068-2-21 Solder the chip to the testing jig (glass epoxy board shown in the right) using eutectic solder. Then apply a force in the direction of the arrow. Size F Duration 0402, 0603 5N 10N 10 ± 1 s 0805 Resistance to Flexure IEC 60068-2-21 Requirements Test Methods and Remarks Solder the chip to the test jig (glass epoxy board shown in the right) using a eutectic solder.
Chip NTC Thermistor Item Standard Solderability IEC 60068-2-58 Resistance to Soldering Heat Temperature Cycling IEC 60068-2-58 IEC 60068-2-14 Test Methods and Remarks • Solder temperature: 245 ± 5℃ • Duration: 10 ± 1s • Solder: Sn/3.0Ag/0.5Cu • Flux: 25% resin and 75% ethanol in weight 1. No visible damage • Solder temperature: 245 ± 5℃ • Duration: 10±1s • Solder: Sn/3.0Ag/0.
Chip NTC Thermistor Notes & Warnings The RND 155QN series thermistors shall not be operated and stored under the following environmental conditions: • Corrosive or deoxidized atmospheres (such as chlorine, sulfurated hydrogen, ammonia, sulfuric acid, nitric oxide and so on) • Volatile or inflammable atmospheres • Dusty condition • Excessively high or low pressure condition • Humid site • Places with brine, oil, chemical liquid or organic solvent • Intense vibration • Places with analogously deleterious cond
Chip NTC Thermistor R-T Table Temp. (℃) R_Min (Kohm) R_Cent (Kohm) R_Max (Kohm) Res TOL. Temp. TOL.(℃) -40 2,802.339 3,052.414 3,316.494 8.65% 1.29 -39 2,631.172 2,864.149 3,109.960 8.58% 1.29 -38 2,471.465 2,688.600 2,917.499 8.51% 1.29 -37 2,322.389 2,524.839 2,738.075 8.45% 1.28 -36 2,183.178 2,372.011 2,570.734 8.38% 1.28 -35 2,053.125 2,229.326 2,414.597 8.31% 1.28 -34 1,931.579 2,096.056 2,268.852 8.24% 1.28 -33 1,817.936 1,971.528 2,132.752 8.
Chip NTC Thermistor Temp. (℃) R_Min (Kohm) R_Cent (Kohm) R_Max (Kohm) Res TOL. Temp. TOL.(℃) 2 271.616 288.962 306.646 6.12% 1.22 3 258.724 275.111 291.805 6.07% 1.22 4 246.514 262.000 277.762 6.02% 1.22 5 234.946 249.584 264.471 5.96% 1.22 6 223.984 237.824 251.888 5.91% 1.21 7 213.592 226.681 239.971 5.86% 1.21 8 203.739 216.121 228.682 5.81% 1.21 9 194.393 206.109 217.985 5.76% 1.21 10 185.526 196.615 207.846 5.71% 1.20 11 177.110 187.
Chip NTC Thermistor Temp. (℃) R_Min (Kohm) R_Cent (Kohm) R_Max (Kohm) Res TOL. Temp. TOL.(℃) 47 38.452 40.840 43.268 5.94% 1.57 48 36.995 39.308 41.660 5.99% 1.59 49 35.600 37.840 40.120 6.03% 1.61 50 34.265 36.435 38.645 6.07% 1.63 51 32.987 35.088 37.231 6.11% 1.65 52 31.762 33.798 35.875 6.15% 1.67 53 30.589 32.562 34.576 6.18% 1.69 54 29.465 31.377 33.330 6.22% 1.71 55 28.388 30.241 32.135 6.26% 1.73 56 27.355 29.152 30.989 6.30% 1.
Chip NTC Thermistor Temp. (℃) R_Min (Kohm) R_Cent (Kohm) R_Max (Kohm) Res TOL. Temp. TOL.(℃) 92 8.099 8.736 9.399 7.59% 2.56 93 7.853 8.473 9.119 7.62% 2.58 94 7.616 8.219 8.849 7.66% 2.60 95 7.386 7.974 8.587 7.69% 2.63 96 7.165 7.738 8.335 7.72% 2.65 97 6.951 7.509 8.091 7.75% 2.68 98 6.745 7.289 7.856 7.79% 2.70 99 6.546 7.075 7.628 7.82% 2.73 100 6.353 6.869 7.408 7.85% 2.75 101 6.167 6.670 7.196 7.88% 2.78 102 5.988 6.478 6.990 7.