Datasheet

7-2. Resistance to soldering heat: (Testing m ethod IEC 68-2-20 Tb)
For other procedures that those specificied below refer to JIS C 5102).
Solder bath method:
Solder temperature: 260±5 °C
Solder temperature Immersion time : 10±1 sec.
Thickness of heat shunt
(Printer wiring board): 1.6 mm
Performance:
Capacitance change Δ C/C: ≤ ± 3%
DF change: Δtan δ : ≤ 1.0% at 1 KHZ
7-3. Vibration proof: (Testing method IEC 68-2-6 Fc
The frequency shall be varied form from 10Hz to 55Hz at 1.5mm amplitude and back to 10Hz In approximately 1 minute
intervals.
This motion shall be applied for a period of 2 hours in each of
3 mutually perpendicular directions. During the last 30 min of vibration
in each direction, checks shall be made for open or short-circuiting and interruption. For other procedures, refer to JIS C 0040.
Performance :
Bending strength: There shall be no open or short-circuiting and the connections must be stabilized.
Appearance: There shall be no such mechanical damage as terminal damage etc.
7-4. Damp heat ( steady state ): (Testing method IEC 68-2-3 Ca)
The capacitor shall be stored at a temperature of 40±2 °C and relative humidity of 90% to 95% for 1000 hours.
And then the capacito
r shall be subjected to standard atmospheric conditions for 1 to 2 hours, after which measurement shall be
made. For other procedures, refer to JIS C 0022.
Performance :
Capacitance change: Δ C/C : ≤ ± 5%
DF change: Δtan δ : ≤ 1.0% at 1 KHZ
Insulation resistance: ≥ 50% of limit value
7-5. Damp heat with load :
The DC rated voltage shall be applied continuously to the capacitor at a temperature of 40±2 °C and a relative humidity of
90%
to 95% for 1000 hours.
And then the capacitor shall be subjected to standard atmospheric conditions for 1 to 2 hours,
after which measurement shall
be made. The load resistor in series with the capacitor shall be 20 Ω to 1 KΩ. For other procedures, refer JIS C 0022.
Performance:
Capacitance change: Δ C/C : ≤ ± 5%
DF change: Δtan δ : ≤ 1.0% at 1 KHZ
Insulation resistance: ≥ 50% of limit value
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