Datasheet

No.
T
es
t
it
e
m
Performance
Test method (refer to
IEC60384-16)
7
Resistance to Solder heat
There should be no visible
damage, ΔC/C<±3%
Ref 4.4 clause
Tb , method 1A
Solder temperature 260±5℃
Immersion time：10±1sec
Initial measurement
Capacitance, Tanδ
Rapid change of
temperature
There should be no visible
damage,
Vibration
8
Bump
There should be no visible
damage, ΔC/C<±3%
Final measurement
There should be no visible
damage,ΔC/C<±3%
Metallized Polypropylene Film
Capacitors (Dipped)
2. Technical Specification
Ref 4.6 clause
θ
A
=-40℃, θ
B
=-+85℃
Duration=30min
There should be no visible
damage.
Ref 4.7 clause
Amplitude 0.75mm or acceleration 0.98m/s
2
,(whichever is the smaller values)
10~500HZ
2h each direction, total 6h
Ref 4.8 clause
4000 times ,acceleration 390m/s
2
Pulse duration 6ms
Distrelec Schweiz AG, Grabenstrasse 6, 8606 Nänikon, Switzerland, T [phone], [e-mail], distrelec.com