Datasheet

SPECIFICATION:

Construcon form 1210

Ceramic type X7R

Dimensions L x H x W 3.2 x 2.5 x 2.5 mm

Temperature range -55...+125 °C

Height 2.5 mm

Length 3.2 mm

Width 2.5 mm

Multilayer Capacitors, SMD

Multilayer Ceramic Capacitors, 1210, X7R

PRODUCT RANGE:

Art. Nr. Capacitance Rated voltage Capacitance tolerance

RND 150-1210B103K102N2 10 nF 1000 VDC ±10%

RND 150-1210B103K501N3 10 nF 500 VDC ±10%

RND 150-1210B104K201N3 100 nF 200 VDC ±10%

RND 150-1210B104K500N2 100 nF 50 VDC ±10%

RND 150-1210B105K101N1 1.0 µF 100 VDC ±10%

RND 150-1210B105K500N3 1.0 µF 50 VDC ±10%

RND 150-1210B106K250N1 10 µF 25 VDC ±10%

RND 150-1210B152K102N2 1.5 nF 1000 VDC ±10%

RND 150-1210B222K102N2 2.2 nF 1000 VDC ±10%

RND 150-1210B223K501N2

22 nF

500 VDC ±10%

RND 150-1210B224K101N2 220 nF 100 VDC ±10%

RND 150-1210B224K201N2 220 nF 200 VDC ±10%

RND 150-1210B225K100N2 2.2 µF 10 VDC ±10%

RND 150-1210B334K201N2 330 nF 200 VDC ±10%

RND 150-1210B473K201N2 47 nF 200 VDC ±10%

RND 150-1210B473K631N2 47 nF 630 VDC ±10%

RND 150-1210B474K101N1 470 nF 100 VDC ±10%

RND 150-1210B474K251N1 470 nF 250 VDC ±10%

RND 150-1210B474K500N2 470 nF 50 VDC ±10%

RND 150-1210B475K500N1 4.7 µF 50 VDC ±10%

Distrelec Schweiz AG, Grabenstrasse 6, 8606 Nänikon, Switzerland, T +41 44 944 99 11, info@distrelec.com, distrelec.com

PAGE 1
Multilayer Capacitors, SMD Multilayer Ceramic Capacitors, 1210, X7R SPECIFICATION: Construction form Ceramic type Dimensions L x H x W Temperature range Height Length Width PRODUCT RANGE: Art. Nr.
PAGE 2
Multilayer Ceramic Capacitors, 0402, Y5V PCB design Chip components are susceptible to board stress since the component itself is mounted directly on the board. They are also sensitive to mechanical and thermal stress when solder, which may cause chip cracked. Please take solder form and component layout into consideration to eliminate stress. Pattern form (1) Placing of chip components and component. incorrect correct (2) Placing close to chassis.
PAGE 3
(4) Lateral mounting correct incorrect Component direction To design a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. (1) put the component lateral to the direction in which stress acts. (2) Component layout close to board separation point.
PAGE 4
12.3. Land Pattern When capacitors are mounted on P.C. board, the amount of solder directly affect the performance of capacitors. Therefore, the following items should be carefully considered in the design of solder land pattern. (1) The greater the amount of solder, the higher the stress on the chip capacitors, and lead to cracking and breaking likely. It is necessary the appropriate size and configuration of the solder pads should be designed to have proper amount of solder on the termination.