Datasheet

PCB design
Chip components are susceptible to board stress since the component itself is mounted
directly on the board. They are also sensitive to mechanical and thermal stress when
solder, which may cause chip cracked.
Please take solder form and component layout into consideration to eliminate stress.
Pattern form
(
1) Placing of chip components and component.
(3) Placing leaded components after chip component.
incorrect correct
correct
(2) Placing close to chassis.
incorrect
incorrect correct
(4) Lateral mounting
incorrect
correct
Multilayer Capacitors , SMD
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