Datasheet

ManualsBrandsRND Components ManualsCapacitorsCeramic Capacitor 100nF 100VDC 1206

Multilayer Capacitors, SMD

Features

• Various temperature characteristics cover a wide range in small size

• Mounted either by flow or reflow soldering methods

• Excellent dielectric strength due to uniform structure of dielectric layers

Applications

• MLCC are used extensively in computers, communicative products, and the detail applications which including the followings:

• Discharge of stored energy

• Blockage of direct current

• Coupling of circuit components

• By-passing of an AC signa

• Frequency discrimination

• Transient voltage and Arc suppression

• Surge protection

Part Numbering

1206 B 102 J 500 N T

SIZE CODE

1206 = .12 X

.06”

B (X7R)

X (X5R)

DIELECTRIC

N (COG)

Y (Y5V)

CAPACITANCE

Value in Pico farads: Two significant figures

Followed by no. of zero. 0R5=0.5pF 2R0=2pF 101=100pF.

CAPACITANCE TOLERANCE

J = ±5.0﹪

M = ±20﹪

K = ±10﹪

250 = 25 VDC

= -20﹪~+80﹪ Tolerances may be restricted by dielectric type.

VOLTAGE

VDC：Tw

o significant figures followed by number of zeros

063 = 6.3 VDC 100 = 10 VDC 160 = 16 VDC

500 = 50 VDC 101 = 100 VDC 501 = 500VDC

102 = 1 KVDC 202 = 2 KVDC

TERMINATION

N =

Nickel barrier with 100﹪Tin

PACKING CODE

2= 2K/Reel 3=

3K/Reel (for plastic tape only)

T= 4K/Reel

Dimension : (UNIT mm)

1206

3.20±0.20

1.60±0.20

Distrelec Schweiz AG, Grabenstrasse 6, 8606 Nänikon, Switzerland, T +41 44 944 99 11, info@distrelec.com, distrelec.com

Summary of content (13 pages)

PAGE 1
Multilayer Capacitors, SMD Features • Various temperature characteristics cover a wide range in small size • Mounted either by flow or reflow soldering methods • Excellent dielectric strength due to uniform structure of dielectric layers Applications • MLCC are used extensively in computers, communicative products, and the detail applications which including the followings: • Discharge of stored energy • Blockage of direct current • Coupling of circuit components • By-passing of an AC signa • Frequency dis
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Multilayer Capacitors, SMD Specifications Construction form Ceramic type Dimensions L x H x W Temperature range Height Length Width 1206 X7R , Y5V , X5R , COG 3.2 x 1.65 x 1.6 mm -55...+125 °C 1.65 mm 3.2 mm 1.6 mm Construction of MLCC Terminations Ag(NME) Cu(BME) Ni Sn Inner Electrodes Ceramic material ( B a T i O 3 based ) Distrelec Schweiz AG, Grabenstrasse 6, 8606 Nänikon, Switzerland, T +41 44 944 99 11, info@distrelec.com, distrelec.
PAGE 3
Multilayer Capacitors, SMD Specifications and Test Methods No 1 2 Item Capacitance Q value / Dissipation Factor Test Method The capacitance shall be measured at 25°C at the frequency and voltage shown below: NPO NPO>1nF, C≧10uF Type Y5V, (≦1nF) X7R/X5R Item Freq.. 1±0.1M z 1±0.1KHz 120H Voltage 1±0.2Vrms 1±0.2Vrms 0.5±0.2 Vrms D.F. shall be measured at 25°C at the frequency and voltage shown a o.1 EXCEPTION OF D.F. X7R/X5R r D.F Exception of D.F. ≧ ≦3.5% 1206≧0.47uF 50V 25V ≦7% 1206≧4.
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Multilayer Capacitors, SMD Specifications and Test Methods No 6 Item Vibration Resistance Test Method *Vibration Frequency: 10 – 55 Hz.min. *Total amplitude: 1.5mm Specification No remarkable damage Cap. Change and Q/D.F.: To meet initial spec. *Test Time: 6 hrs ( Two hrs each in three mutually perpendicular direction ) 7 Resistance to Soldering Heat Preheat the capacitor at 120~150° C for 1min. Have the capacitor dip into the solder bath at 270±5°C for 10±1 sec.
PAGE 5
Multilayer Capacitors, SMD Specifications and Test Methods No 9 Item Temperature Coefficient Test Method Specification (a) NPO The temperature coefficient is determined using the capacitance measured in step 3 as a reference. When cycling the temperature sequentially from step 1 through 5. The capacitance shall be within the specified tolerance for the temperature coefficient.
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Multilayer Capacitors, SMD Specifications and Test Methods 11 Humidity ( Damp Heat) Steady State *No remarkable damage *Test temp.: 40±2°C *Humidity: 90～95% RH *Test time: 500 hrs *Measurement to be made after keeping at room temperature for 48±4 hrs. EXCEPTION OF D.F. X7R/X5R: Vr D.F ≧ ≦6% 50V Y5V: Vr 25V D.F ≦10% Exception of D.F. 1206≧0.47uF Exception of D.F. 1206≧1.0 uF *Cap. Change : NPO: ±5% or ±0.5 pF whichever is larger X7R/X5R:≧10V: ±12.5%, 6.3V : ±25% Y5V: ±30% *Q value/D.F.
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Multilayer Capacitors, SMD Soldering & Cleaning Recommended Soldering Profile (Prevention of thermal shock) Figure.(I) IR reflow soldering profile for SMT process with SnAgCu series solder paste , (lead free type) Distrelec Schweiz AG, Grabenstrasse 6, 8606 Nänikon, Switzerland, T +41 44 944 99 11, info@distrelec.com, distrelec.
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Multilayer Capacitors, SMD PCB design Chip components are susceptible to board stress since the component itself is mounted directly on the board. They are also sensitive to mechanical and thermal stress when solder, which may cause chip cracked. Please take solder form and component layout into consideration to eliminate stress. Pattern form (1) Placing of chip components and component. incorrect correct (2) Placing close to chassis. incorrect correct (3) Placing leaded components after chip component.
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Product Range: Art. Nr.
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Art. Nr.
PAGE 11
Art. Nr.
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Art. Nr. RND 150-1206B473K500NT RND 150-1206B474J500N2 RND 150-1206B474K100N3 RND 150-1206B474K160N3 RND 150-1206B474K250N3 RND 150-1206B474K500N2 RND 150-1206B475K250N2 RND 150-1206B475K500N2 RND 150-1206B561K500NT RND 150-1206B564K250N3 RND 150-1206B681K102N3 RND 150-1206B681K202N3 RND 150-1206B681K500NT RND 150-1206B681K631N3 RND 150-1206B682K500NT RND 150-1206B683K500NT RND 150-1206B684K160N3 RND 150-1206B684K250N3 RND 150-1206B684K500N2 Capacitance 47 nF 470 nF 470 nF 470 nF 470 nF 470 nF 4.7 µF 4.
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Capacitance Art. Nr. Rated Voltage Capacitance Tolerance RND 1501206F105Z160 RND 1501206F105Z250 RND 1501206F105Z500 RND 1501206F106Z100 RND 1501206F106Z160 RND 1501206F106Z250 RND 1501206F225Z160 RND 1501206F226Z100 RND 1501206F335Z160 RND 1501206F474Z250 RND 1501206F475Z160 RND 1501206F475Z250 1 µF 1 µF 1 µF 10 µF 10 µF 10 µF 2.2 µF 22 µF 3.3 µF 470 nF 4.7 µF 4.