Datasheet

Pattern form
(1) Placing of chip components and component.
(3) Placing leaded components after chip component.
incorrect correct
correct
(2) Placing close to chassis.
incorrect
incorrect correct
Multilayer Ceramic Capacitors, 0805
PCB design
Chip components are susceptible to board stress since the component itself is mounted directly on
the board. They are also sensitive to mechanical and thermal stress when solder, which may
cause chip cracked.
Please take solder form and component layout into consideration to eliminate stress.