Datasheet

SPECIFICATION:

Construcon form 0805

Ceramic type Y5V

Capacitance tolerance -20...+80%

Height 1.25 mm

Length 2.0 mm

Temperature range

-25...+85 °C

Width 1.25 mm

Multilayer Capacitors, SMD

Multilayer Ceramic Capacitors, 0805, Y5V

PRODUCT RANGE:

Art. Nr. Capacitance Rated voltage

RND 1500805Y103Z500NT 10 nF 50 VDC

RND 1500805Y104Z160NT 100 nF 16 VDC

RND 1500805Y104Z250NT 100 nF 25 VDC

RND 1500805Y104Z500NT 100 nF 50 VDC

RND 1500805Y105Z500N3 1.0 µF 50 VDC

RND 1500805Y106Z063N3 10 µF 6.3 VDC

RND 1500805Y106Z100N3 10 µF 10 VDC

RND 1500805Y154Z250NT 150 nF 25 VDC

RND 1500805Y154Z500NT 150 nF 50 VDC

RND 1500805Y155Z160N3 1.5 µF 16 VDC

RND 1500805Y223Z500NT 22 nF 50 VDC

RND 1500805Y224Z160NT 220 nF 16 VDC

RND 1500805Y224Z250NT 220 nF 25 VDC

RND 1500805Y224Z500NT 220 nF 50 VDC

RND 1500805Y225Z160N3 2.2 µF 16 VDC

RND 1500805Y333Z500NT 33 nF 50 VDC

RND 1500805Y334Z250NT 330 nF 25 VDC

RND 1500805Y335Z100N3 3.3 µF 10 VDC

RND 1500805Y473Z500NT 47 nF 50 VDC

RND 1500805Y474Z160NT 470 nF 16 VDC

RND 1500805Y475Z100N3 4.7 µF 10 VDC

RND 1500805Y475Z160N3 4.7 µF 16 VDC

RND 150C0805X106K100N3 10 µF 10 VDC

Distrelec Schweiz AG, Grabenstrasse 6, 8606 Nänikon, Switzerland, T +41 44 944 99 11, info@distrelec.com, distrelec.com

PAGE 1
Multilayer Capacitors, SMD Multilayer Ceramic Capacitors, 0805, Y5V SPECIFICATION: Construction form Ceramic type Capacitance tolerance Height Length Temperature range Width PRODUCT RANGE: Art. Nr.
PAGE 2
Multilayer Ceramic Capacitors, 0402, Y5V PCB design Chip components are susceptible to board stress since the component itself is mounted directly on the board. They are also sensitive to mechanical and thermal stress when solder, which may cause chip cracked. Please take solder form and component layout into consideration to eliminate stress. Pattern form (1) Placing of chip components and component. incorrect correct (2) Placing close to chassis.
PAGE 3
(4) Lateral mounting correct incorrect Component direction To design a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. (1) put the component lateral to the direction in which stress acts. (2) Component layout close to board separation point.
PAGE 4
12.3. Land Pattern When capacitors are mounted on P.C. board, the amount of solder directly affect the performance of capacitors. Therefore, the following items should be carefully considered in the design of solder land pattern. (1) The greater the amount of solder, the higher the stress on the chip capacitors, and lead to cracking and breaking likely. It is necessary the appropriate size and configuration of the solder pads should be designed to have proper amount of solder on the termination.