Datasheet

SPECIFICATION:

Construcon form 0603

Ceramic type X5R

Dimensions L x H x W 1.6 x 0.6 x 0.6 mm

Temperature range

-55...+8

5 °C

Height 0.6 mm

Length 1.6 mm

Width 0.6 mm

Multilayer Capacitors, SMD

Multilayer Ceramic Capacitors, 0603, X5R

PRODUCT RANGE:

Art. Nr. Capacitance Rated voltage Capacitance tolerance

RND 150-0603X105K063NT 1.0 µF 6.3 VDC ±10%

RND 150-0603X105K100NT 1.0 µF 10 VDC ±10%

RND 150-0603X105K160NT 1.0 µF 16 VDC ±10%

RND 150-0603X105K250NT 1.0 µF 25 VDC ±10%

RND 150-0603X105M063NT 1.0 µF 6.3 VDC ±20%

RND 150-0603X106M063NT 10 µF 6.3 VDC ±20%

RND 150-0603X224K160NT 220 nF 16 VDC ±10%

RND 150-0603X224K250NT 220 nF 25 VDC ±10%

RND 150-0603X225K063NT 2.2 µF 6.3 VDC ±10%

RND 150-0603X225K100NT 2.2 µF 10 VDC ±10%

RND 150-0603X334K100NT 330 nF 10 VDC ±10%

RND 150-0603X334K160NT 330 nF 16 VDC ±10%

RND 150-0603X474K100NT 470 nF 10 VDC ±10%

RND 150-0603X474K160NT 470 nF 16 VDC ±10%

RND 150-0603X475K063NT 4.7 µF 6.3 VDC ±10%

RND 150-0603X475K100NT 4.7 µF 10 VDC ±10%

RND 150-0603X684K100NT 680 nF 10 VDC ±10%

RND 150-0603X684K160NT 680 nF 16 VDC ±10%

Distrelec Schweiz AG, Grabenstrasse 6, 8606 Nänikon, Switzerland, T +41 44 944 99 11, info@distrelec.com, distrelec.com

PAGE 1
Multilayer Capacitors, SMD Multilayer Ceramic Capacitors, 0603, X5R SPECIFICATION: Construction form Ceramic type Dimensions L x H x W Temperature range Height Length Width PRODUCT RANGE: Art. Nr.
PAGE 2
Multilayer Ceramic Capacitors, 0402, Y5V PCB design Chip components are susceptible to board stress since the component itself is mounted directly on the board. They are also sensitive to mechanical and thermal stress when solder, which may cause chip cracked. Please take solder form and component layout into consideration to eliminate stress. Pattern form (1) Placing of chip components and component. incorrect correct (2) Placing close to chassis.
PAGE 3
(4) Lateral mounting correct incorrect Component direction To design a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. (1) put the component lateral to the direction in which stress acts. (2) Component layout close to board separation point.
PAGE 4
12.3. Land Pattern When capacitors are mounted on P.C. board, the amount of solder directly affect the performance of capacitors. Therefore, the following items should be carefully considered in the design of solder land pattern. (1) The greater the amount of solder, the higher the stress on the chip capacitors, and lead to cracking and breaking likely. It is necessary the appropriate size and configuration of the solder pads should be designed to have proper amount of solder on the termination.