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ManualsBrandsRND Components ManualsCapacitorsCeramic Capacitor 4.7pF 50VDC 0603

Table Of Contents

SPECIFICATION:

Construcon form 0603

Ceramic type NP0

Dimensions L x H x W 1.6 x 0.6 x 0.6 mm

Temperature range

-55...+12

5 °C

Height 0.6 mm

Length 1.6 mm

Width 0.6 mm

Multilayer Capacitors, SMD

Multilayer Ceramic Capacitors, 0603, NP0

PRODUCT RANGE:

Art. Nr. Capacitance Rated voltage Capacitance tolerance

RND 150-0603N0R5C500NT 0.5 pF 50 VDC ±0.25 pF

RND 150-0603N100F101NT 10 pF 100 VDC ±1%

RND 150-0603N100F500NT 10 pF 50 VDC ±1%

RND 150-0603N100J101NT 10 pF 100 VDC ±5%

RND 150-0603N100J201NT 10 pF 200 VDC ±5%

RND 150-0603N100J500NT 10 pF 50 VDC ±5%

RND 150-0603N101F101NT 100 pF 100 VDC ±1%

RND 150-0603N101F500NT 100 pF 50 VDC ±1%

RND 150-0603N101J101NT 100 pF 100 VDC ±5%

RND 150-0603N101J201NT 100 pF 200 VDC ±5%

RND 150-0603N101J500NT 100 pF 50 VDC ±5%

RND 150-0603N102F500NT 1.0 nF 50 VDC ±1%

RND 150-0603N102J500NT 1.0 nF 50 VDC ±5%

RND 150-0603N120J101NT 12 pF 100 VDC ±5%

RND 150-0603N120J500NT 12 pF 50 VDC ±5%

RND 150-0603N121J500NT 120 pF 50 VDC ±5%

RND 150-0603N150F101NT 15 pF 100 VDC ±1%

RND 150-0603N150F500NT 15 pF 50 VDC ±1%

RND 150-0603N150J500NT 15 pF 50 VDC ±5%

RND 150-0603N151F500NT 150 pF 50 VDC ±1%

RND 150-0603N151J101NT 150 pF 100 VDC ±5%

RND 150-0603N151J201NT 150 pF 200 VDC ±5%

RND 150-0603N151J500NT 150 pF 50 VDC ±5%

RND 150-0603N180J101NT 18 pF 100 VDC ±5%

RND 150-0603N180J500NT 18 pF 50 VDC ±5%

RND 150-0603N181J500NT 180 pF 50 VDC ±5%

RND 150-0603N1R0C201NT 1.0 pF 200 VDC ±0.25 pF

RND 150-0603N1R0C500NT 1.0 pF 50 VDC ±0.25 pF

RND 150-0603N1R5C500NT 1.5 pF 50 VDC ±0.25 pF

RND 150-0603N220F500NT 22 pF 50 VDC ±1%

RND 150-0603N220J101NT 22 pF 100 VDC ±5%

Distrelec Schweiz AG, Grabenstrasse 6, 8606 Nänikon, Switzerland, T +41 44 944 99 11, info@distrelec.com, distrelec.com

Summary of content (5 pages)

PAGE 1
Multilayer Capacitors, SMD Multilayer Ceramic Capacitors, 0603, NP0 SPECIFICATION: Construction form Ceramic type Dimensions L x H x W Temperature range Height Length Width PRODUCT RANGE: Art. Nr.
PAGE 2
Art. Nr.
PAGE 3
Multilayer Ceramic Capacitors, 0402, Y5V PCB design Chip components are susceptible to board stress since the component itself is mounted directly on the board. They are also sensitive to mechanical and thermal stress when solder, which may cause chip cracked. Please take solder form and component layout into consideration to eliminate stress. Pattern form (1) Placing of chip components and component. incorrect correct (2) Placing close to chassis.
PAGE 4
(4) Lateral mounting correct incorrect Component direction To design a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. (1) put the component lateral to the direction in which stress acts. (2) Component layout close to board separation point.
PAGE 5
12.3. Land Pattern When capacitors are mounted on P.C. board, the amount of solder directly affect the performance of capacitors. Therefore, the following items should be carefully considered in the design of solder land pattern. (1) The greater the amount of solder, the higher the stress on the chip capacitors, and lead to cracking and breaking likely. It is necessary the appropriate size and configuration of the solder pads should be designed to have proper amount of solder on the termination.