Datasheet

ManualsBrandsRND Components ManualsCapacitorsCeramic Capacitor 330pF 50VDC 0603

Multilayer Capacitors, SMD

Multilayer Ceramic Capacitors, 0603, X7R

• Various temperature characteristics cover a wide range in small size

• Mounted either by flow or reflow soldering methods

• Excellent dielectric strength due to uniform structure of dielectric layers

Applications

• MLCC are used extensively in computers, communicative products, and the detail applications which including the followings:

• Discharge of stored energy

• Blockage of direct current

• Coupling of circuit components

• By-passing of an AC signal

• Frequency discrimination

• Transient voltage and Arc suppression

• Surge protection

Part Numbering

0603 B 101 J 101 N T

SIZE CODE

0603 = .06X .03”

DIELECTRIC

B (X7R)

CAPACITANCE

Value in Pico farads: Two significant figures

Followed by no. of zero. 0R5=0.5pF 2R0=2pF 101=100pF.

CAPACITANCE TOLERANCE

250 = 25 VDC

J = ±5.0﹪

K =

±10﹪

Tolerances may be restricted by dielectric type.

VOLTAGE

VDC：Two significant figures followed by number of zeros

063 = 6.3 VDC 100 = 10 VDC 160 = 16 VDC 500 = 50

VDC 101 = 100 VDC 501 = 500VDC 102 = 1 KVDC

202 = 2 KVDC

TERMINATION

N =

Nickel barrier with 100﹪Tin

PACKING CODE

T= Cut Tape

Dimension : (UNIT mm)

0603

1.6±0.10

0.80±0.10

Features

Distrelec Schweiz AG, Grabenstrasse 6, 8606 Nänikon, Switzerland, T +41 44 944 99 11, info@distrelec.com, distrelec.com

Summary of content (7 pages)

PAGE 1
Multilayer Capacitors, SMD Multilayer Ceramic Capacitors, 0603, X7R Features • Various temperature characteristics cover a wide range in small size • Mounted either by flow or reflow soldering methods • Excellent dielectric strength due to uniform structure of dielectric layers Applications • MLCC are used extensively in computers, communicative products, and the detail applications which including the followings: • Discharge of stored energy • Blockage of direct current • Coupling of circuit components •
PAGE 2
Multilayer Capacitors, SMD Multilayer Ceramic Capacitors, 0603, X7R SPECIFICATION: Construction form Ceramic type Dimensions L x H x W Temperature range Height Length Width PRODUCT RANGE: Art. Nr.
PAGE 3
Art. Nr.
PAGE 4
Art. Nr. RND 150-0603B683K160NT RND 150-0603B683K250NT RND 150-0603B683K500NT RND 150-0603B684K100NT RND 150-0603B821K500NT RND 150-0603B822K500NT RND 150-0603B823K250NT RND 150-0603B823K500NT RND 150-0603B222J500NT Capacitance 68 nF 68 nF 68 nF 680 nF 820 pF 8.2 nF 82 nF 82 nF 2.
PAGE 5
Multilayer Ceramic Capacitors, 0603 PCB design Chip components are susceptible to board stress since the component itself is mounted directly on the board. They are also sensitive to mechanical and thermal stress when solder, which may cause chip cracked. Please take solder form and component layout into consideration to eliminate stress. Pattern form (1) Placing of chip components and component. incorrect correct (2) Placing close to chassis.
PAGE 6
(4) Lateral mounting correct incorrect Component direction To design a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. (1) put the component lateral to the direction in which stress acts. (2) Component layout close to board separation point.
PAGE 7
12.3. Land Pattern When capacitors are mounted on P.C. board, the amount of solder directly affect the performance of capacitors. Therefore, the following items should be carefully considered in the design of solder land pattern. (1) The greater the amount of solder, the higher the stress on the chip capacitors, and lead to cracking and breaking likely. It is necessary the appropriate size and configuration of the solder pads should be designed to have proper amount of solder on the termination.