Datasheet

(4) Lateral mounting
incorrect correct
Compo
nent direction
To design a mounting position that minimizes the stress imposed on the chip during flexing or
bending of the board.
(1) put the component
lateral to the direction in which stress acts.
(2) C
omponent layout close to board separation point.
Susceptibility to stress in the order: A
＞C＞B＝D
A
slit
D
B
C