Instruction manual

20 IIMS01J02-E1

3. MOUNTING

This chapter describes the mounting procedures for the H-PCP-J modules. For details of the mounting

procedures for other modules and the mounting position of the control unit, see the Hardware

Instruction Manual (IMSRM15-E).

3.1 Mounting Cautions

(1) This instrument is intended to be used under the following environmental conditions. (IEC61010-1)

[OVERVOLTAGE CATEGORY II, POLLUTION DEGREE 2]

(2) Use this instrument within the following ambient temperature and ambient humidity.

• Ambient temperature: 0 to 50 °C

• Ambient humidity: 45 to 85 % RH

(Absolute humidity: MAX. W. C 29 g/m

dry air at 101.3 kPa)

(3) Avoid the following conditions when selecting the mounting location:

• Rapid changes in ambient temperature which may cause condensation.

• Corrosive or inflammable gases.

• Direct vibration or shock to the mainframe.

• Water, oil, chemicals, vapor or steam splashes.

• Excessive dust, salt or iron particles.

• Excessive induction noise, static electricity, magnetic fields or noise.

• Direct air flow from an air conditioner.

• Exposure to direct sunlight.

• Excessive heat accumulation.

To prevent electric shock or instrument failure, always turn off the power before

mounting or removing the modules.

WARNING