Specifications

RF-BM-BG22A1
www.szrfstar.comV1.0 - Sep., 2020
Table of Contents
1 Device Overview ..................................................................................................................................... 1
1.1 Module Series ........................................................................................................................... 1
1.2 Description.................................................................................................................................... 1
1.3 Key Features ................................................................................................................................ 1
1.4 Applications .................................................................................................................................. 2
1.5 Functional Block Diagram ........................................................................................................... 2
1.6 Part Number Conventions .......................................................................................................... 2
Table of Contents ....................................................................................................................................... 5
Table of Figures ......................................................................................................................................... 6
Table of Tables ........................................................................................................................................... 6
2 Module Configuration and Functions .................................................................................................... 7
2.1 Module Parameters ..................................................................................................................... 7
2.2 Module Pin Diagram .................................................................................................................... 8
2.3 Pin Functions ............................................................................................................................... 8
3 Specifications ........................................................................................................................................ 10
3.1 Recommended Operating Conditions ..................................................................................... 10
3.2 Handling Ratings ....................................................................................................................... 10
3.3 Current Consumption ................................................................................................................ 10
4 Application, Implementation, and Layout ........................................................................................... 11
4.1 Module Photos ........................................................................................................................... 11
4.2 Recommended PCB Footprint ................................................................................................. 11
4.3 Schematic Diagram and Reference Design ............................................................................ 12
4.4 Basic Operation of Hardware Design ...................................................................................... 13
4.5 Trouble Shooting ........................................................................................................................ 14
4.5.1 Unsatisfactory Transmission Distance .......................................................................... 14
4.5.2 Vulnerable Module .......................................................................................................... 15
4.5.3 High Bit Error Rate.......................................................................................................... 15
4.6 Electrostatics Discharge Warnings .......................................................................................... 15
4.7 Soldering and Reflow Condition ............................................................................................... 15
4.8 Optional Packaging ................................................................................................................... 17
5 Revision History .................................................................................................................................... 17
6 Contact Us ............................................................................................................................................. 18
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