RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 RF-BM-2642B1 SimpleLink™ Bluetooth® 5 Low Energy Wireless Module Version 1.0 Shenzhen RF-star Technology Co., Ltd. Jan. 19th, 2020 Shenzhen RF-star Technology Co., Ltd.
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 TI CC264X BLE Module List Chipset CC2640 R2FRSM Core M3 Flash RAM (Byte) (KB) 128 28 TX Power 2 R2FRGZ 128 28 Range (mm) (M) PCB 11.2 16.6 300 RF-BM-4044B3 IPEX 11.2 15.2 500 RF-BM-4044B4 CHIP 88 150 RF-BM-4077B1 PCB 17 23.5 500 RF-BM-4077B2 PCB 17 23.5 500 RF-BM-2642B1 PCB 17 23.
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 1 Device Overview 1.1 Description RF-BM-2642B1 is an RF module based on TI lower-power CC2642R SoC. It integrates a 48 MHz crystal and a 32.768 kHz crystal, 352 KB of in-system Programmable Flash, 256 KB ROM, 8 KB of cache SRAM, 80 KB of ultra-low leakage SRAM. Its ARM® Cortex®-M4F core application processor can operate at an extremely low current at flexible power modes. Its 2.4 GHz RF transceiver compatible with Bluetooth 5 Low Energy.
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 - Standby: 0.94 µA (RTC on, 80 KB RAM and CPU - Shutdown: 150 nA (wakeup on external events) retention) 1.
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 Table of Contents TI CC264X BLE Module List .......................................................................................................................................... 2 1 Device Overview ............................................................................................................................................................. 3 1.1 Description....................................................................................
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 4.7 Soldering and Reflow Condition................................................................................................................. 17 4.8 Optional Packaging ......................................................................................................................................... 18 5 Revision History ................................................................................................................................
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 2 Module Configuration and Functions 2.1 Module Parameters Table 1. Parameters of RF-BM-2642B1 Chipset CC2642R Supply Power Voltage 1.8 V ~ 3.8 V, recommended to 3.3 V Frequency 2402 MHz ~ 2480 MHz Maximum Transmit Power +5.0 dBm Receiving Sensitivity -97 dBm GPIO 31 RX current: 6.9 mA TX current: 7.3 mA @ 0 dBm 9.6 mA @ 5 dBm MCU 48 MHz (CoreMark):3.4 mA (71 μA/MHz) Power Consumption Sensor Controller：30.
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 2.2 Module Pin Diagram Figure 3. Pin Diagram of RF-BM-2642B1 2.3 Pin Functions Table 2.
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan.
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 3 Specifications 3.1 Recommended Operating Conditions Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table below. Long-term work beyond this limit will affect the reliability of the module more or less. Table 3. Recommended Operating Conditions of RF-BM-2642B1 Condition Items Min. Typ. Max. Unit Operating Supply Voltage / 1.8 3.3 3.
RF-BM-2642B1 www.szrfstar.com retention V1.0 - Jan., 2020 RCOSC_LF RTC running, CPU, 80 KB RAM and (partial) register retention. 1.09 μA 3.2 μA 3.3 μA 675 μA 3.39 mA Delta current with domain enabled 97.7 μA Delta current with domain enabled 7.2 μA 210.9 μA XOSC_LF RTC running, CPU, 80 KB RAM and (partial) register retention. Standby RCOSC_LF with cache retention RTC running, CPU, 80 KB RAM and (partial) register retention.
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 3.3.2 Radio Mode Table 6. Table of Power Consumption on Radio Mode Measured on the RF-BM-2642B1 reference design with Tc = 25°C, VDDS = 3.0 V with internal DC/DC converter, unless otherwise noted. Parameter Radio Receive Current Test Conditions 2440 MHz Typ. Unit 6.9 mA 7.3 mA 9.6 mA +5 dBm output power setting 2440 MHz Radio Transmit Current +5 dBm output power setting 2440 MHz Shenzhen RF-star Technology Co., Ltd.
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 4 Application, Implementation, and Layout 4.1 Module Photos Figure 3. Photos of RF-BM-2642B1 4.2 Recommended PCB Footprint Figure 4. Recommended PCB Footprint of RF-BM-2642B1 Shenzhen RF-star Technology Co., Ltd.
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 4.3 Schematic Diagram Figure 5. Schematic Diagram of RF-BM-2642B1 4.4 Basic Operation of Hardware Design 1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient and the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power supply. Otherwise, the reverse connection may cause permanent damage to the module; 2.
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 Layer or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees; 6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect the module performance. It is recommended to stay away from the module according to the strength of the interference. If circumstances permit, appropriate isolation and shielding can be done. 7.
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 4.5 Trouble Shooting 4.5.1 Unsatisfactory Transmission Distance 1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened. Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The performances of ground absorption and reflection of radio waves will be poor, when the module is tested close to the ground. 2.
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 2. Modules must be placed in anti- static areas. 3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design. Static may result in the degradation in performance of module, even causing the failure. 4.7 Soldering and Reflow Condition 1. Heating method: Conventional Convection or IR/convection. 2. Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or equivalent methods. 3.
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 4.8 Optional Packaging Figure 5. Optional Packaging Mode Note: Default tray packaging. Shenzhen RF-star Technology Co., Ltd.
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 5 Revision History Date Version No. Description 2019.09.11 V1.0 The initial version is released. 2020.01.19 V1.0 Add TI CC264X BLE module list. Shenzhen RF-star Technology Co., Ltd.
RF-BM-2642B1 www.szrfstar.com V1.0 - Jan., 2020 6 Contact Us SHENZHEN RF-STAR TECHNOLOGY CO., LTD. Shenzhen HQ: Add.: Room 601, Block C, Skyworth Building, High-tech Park, Nanshan District, Shenzhen, Guangdong, China Tel.: 86-755-3695 3756 Chengdu Branch: Add.: No. B4-12, Building No.1, No. 1480 Tianfu Road North Section (Incubation Park), High-Tech Zone, Chengdu, China (Sichuan) Free Trade Zone, 610000 Tel.: 86-28-6577 5970 Email: sunny@szrfstar.com, sales@szrfstar.com Web.: www.szrfstar.
FCC Statement FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247 PCB Antenna with Antenna gain：0dBi This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
