Specifications

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12.Wireless module before the SMT note:
1.When customers Open stencil must be sure the hole bigger to the Wireless module
plate, please press 1 to 1 and 0.7 mm is widened to open outward, the thickness of
0.12 mm.
2.Can't get the wifi module bare hands when needs,must we wear the gloves and
static ring.
3.The furnace temperature according to the size of the customer the
mainboard ,generally like to stick on a tablet standard temperature of 250 + - 5,can do
260 + - 5.
Storage and use Wifi module control should pay attention to the following
matters:
1.Module of the storage life of vacuum packaging：
1-1.Storage life：12 months. Storage conditions:<40℃. Relative humidity:<90%R.H.
1-2.After this bag is opened , devices that will be subjected to infrared reflow,
vWIFIor-phase reflow, or equivalent processing must be :
1-3.Check the humidity card :stored at ≦20%RH.If :30%~40%(pink)or greater than
40%(red).Labeling module has moisture absorption.
① Mounthed within 168 hours at factory conditions of: t≦30%℃，≦
60%R.H.
② Once opened, the workshop the preservation of life for 168 hours.
1-4.If baking is required,devices may be baked for:
① Modules must be to remove module moisture problem.
② Baking temperature: 125 ℃, 8 hours.
③ After baking, put proper amount of desiccant to seal packages.
1-5. The actual number of module vacuum packing which is based on the actual
number of packages to the customer requirements.
2.Module reel packaging items as follows.
2-1.Storage life：12 months. Storage conditions:<40℃. Relative humidity:<90%R.H.
2-2.Module WIFIart packing after 168 hours，To launch patch need to bake, to
remove the module hygroscopic, baking temperature conditions：125℃，8hours.
2-3. The actual number of module reel packing which is based on the actual number
of packages to the customer requirements.
3.Module pallet packaging items as follows：
3-1.Storage life：3 months. Storage conditions:<40℃. Relative humidity:<90%R.H.
3-2.Module if not used within 48 hours, before launch the need for baking, baking
temperature: 125 ℃, 8 hours.
3-3. Pallet packaging each plate is 100 PCS.The actual number of module pallet
packing which is based on the actual number of packages to the customer
requirements.
12.Wifi 模块贴片装机前注意事项：
1.客户在开钢网时一定要将 wifi 模块焊盘的孔开大，请按 1 比 1 再
向外扩大 0.7mm 比例开钢网，厚度按 0.12mm.
2.有需要拿 wifi 模块时不可以光手去拿，一定要戴上手套以及静电
环.
3.过炉温度要根据客户主板的大小而定，一般像平板电脑上的标准温
度为250+-5°，也可以做到260+-5°
Wifi 模块储存及使用管制应注意事项如下：
1.模块的真空包装之储存期限：
1-1.保存期限：12个月，储存环境条件：温度在：<40℃，相对湿度：
<90%R.H.
1-2.模块包装被拆后，SMT 组装之时限：
1-3.检查湿度卡：显示值应小于30%（蓝色）， 如 ： 30%~40%(粉红色）
或者大于40%（红色）表示模块已吸湿气.
① 工厂环境温度湿度管制：≦30%℃，≦60%R.H。
② 拆封后，车间的保存寿命为 168 小时.
1-4.如在拆封后的 168 个小时内未使用完，需要烘烤，烘烤条件如下：
① 模块须重新烘烤，以除去模块吸湿问题.
② 烘烤温度条件：125℃，8 小时.
③ 烘烤后，放入适量的干燥剂再密封包装.
1-5. 模块真空包装数量以客户要求的实际包装数量为准.
2.模块卷盘包装事项如下：
2-1.保存期限：12个月，储存环境条件：温度在：<40℃，相对湿度：
<90%R.H.
2-2.模块拆开包装168小时后，如要上线贴片需要重新烘烤，以除去
模块吸湿问题，烘烤温度条件：125℃，8小时。
2-3. 模块卷盘包装以客户要求的实际包装数量为准.
3.模块托盘包装事项如下：
3-1.保存期限：3个月，储存环境条件：温度在：<40℃，相对湿度：
<90%R.H.
3-2.模块如在 48 小时内未使用，在上线之前需要进行烘烤，烘烤温
度条件：125℃，8 小时。
3-3. 托盘包装每盘为 100pcs，模块托盘包装以客户要求的实际包装
数量为准.
注：以上包装方式根据客户要求而定，包装以实际出货为准.