Datasheet

R01DS0041EJ0150 Rev.1.50 Page 114 of 221
Oct 18, 2013
RX210 Group 5. Electrical Characteristics
[Chip version B with 768 Kbytes/1 Mbyte of flash memory and 100 to 145 pins]
Note 1. Supply current values do not include output charge/discharge current from all pins. The values apply when internal pull-up MOSs
are in the off state.
Note 2. Clock supply to the peripheral functions is stopped. This does not include BGO operation. The clock source is PLL and the VCO
oscillation frequency is 100 MHz. BCLK, FCLK, and PCLK are set to divided by 64.
Note 3. Clocks are supplied to the peripheral functions. This does not include BGO operation. The clock source is PLL and the VCO
oscillation frequency is 100 MHz. BCLK, FCLK, and PCLK are ICLK divided by 2.
Note 4. This is the increase if data is programmed to or erasing from the ROM or E2 DataFlash during program execution.
Table 5.15 DC Characteristics (14)
Conditions: VCC = AVCC0 = 2.7 to 5.5 V, VSS = AVSS0 = VREFL = VREFL0 = 0 V, T
a
= –40 to +105°C
Item Symbol Typ. Max. Unit
Test
Conditions
Supply
current*
1
High-speed
operating mode
Normal operating
mode
No peripheral
operation*
2
ICLK = 50 MHz I
CC
7.8 — mA
All peripheral
operation:
Normal*
3
ICLK = 50 MHz 29.8 —
All peripheral
operation:
Max.*
3
ICLK = 50 MHz — 45
Sleep mode No peripheral
operation
ICLK = 50 MHz 4.3 —
All peripheral
operation:
Normal
ICLK = 50 MHz 13.5 —
All-module clock stop mode 3.7 —
Increase during BGO operation*
4
23 —