Datasheet

User’s Manual U18172EJ3V0UD
309
CHAPTER 21 RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the following recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Caution For soldering methods and conditions other than those recommended below, contact an NEC
Electronics sales representative.
Table 21-1. Surface Mounting Type Soldering Conditions
• 10-pin plastic SSOP (lead-free products)
μ PD78F9200MA-CAC-A, 78F9201MA-CAC-A, 78F9202MA-CAC-A, 78F9500MA-CAC-A, 78F9501MA-CAC-A,
78F9502MA-CAC-A
Soldering Method Soldering Conditions Recommended
Condition Symbol
Infrared reflow Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
Note
(after that, prebake at 125°C for
10 to 72 hours)
IR60-107-3
Wave soldering For details, contact an NEC Electronics sales representative.
−
Partial heating Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
−
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
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