Datasheet

78K0/Ix2 CHAPTER 30 RECOMMENDED SOLDERING CONDITIONS
R01UH0010EJ0500 Rev.5.00 722
Feb 28, 2012
Table 30-1. Surface Mounting Type Soldering Conditions (2/2)
(2) 32-pin plastic WQFN (fine pitch) (5 x 5)
PD78F0745K8-3B4-AX, 78F0746K8-3B4-AX, 78F0755K8-3B4-AX, 78F0756K8-3B4-AX
Soldering Method Soldering Conditions Recommended
Condition Symbol
Infrared reflow Package peak temperature: 260C, Time: 60 seconds max. (at 220C or higher),
Count: 3 times or less, Exposure limit: 7 days
Note
(after that, prebake at 125C for
10 to 72 hours)
IR60-107-3
Note After opening the dry pack, store it at 25C or less and 65% RH or less for the allowable storage period.
Cautions 1. Do not use different soldering methods together (except for partial heating).
2. The 78K0/Ix2 microcontrollers have an on-chip debug function, which is provided for development
and evaluation. Do not use the on-chip debug function in products designated for mass production,
because the guaranteed number of rewritable times of the flash memory may be exceeded when this
function is used, and product reliability therefore cannot be guaranteed. Renesas Electronics is not
liable for problems occurring when the on-chip debug function is used.