Datasheet

78K0/Ix2 CHAPTER 30 RECOMMENDED SOLDERING CONDITIONS
R01UH0010EJ0500 Rev.5.00 721
Feb 28, 2012
CHAPTER 30 RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact a Renesas Electronics
sales representative.
For technical information, see the following website.
Semiconductor Package Mount Manual (http://www.renesas.com/products/package/manual/index.jsp)
Table 30-1. Surface Mounting Type Soldering Conditions (1/2)
(1) 16-pin plastic SSOP (5.72 mm (225))
PD78F0740MA-FAA-AX, 78F0741MA-FAA-AX, 78F0742MA-FAA-AX, 78F0750MA-FAA-AX,
78F0751MA-FAA-AX, 78F0752MA-FAA-AX
20-pin plastic SSOP (7.62 mm (300))
PD78F0743MC-CAA-AX, 78F0744MC-CAA-AX, 78F0753MC-CAA-AX, 78F0754MC-CAA-AX
20-pin plastic SOP (7.62 mm (300))
PD78F0743MC-GAB-AX, 78F0744MC-GAB-AX, 78F0753MC-GAB-AX, 78F0754MC-GAB-AX
30-pin plastic SSOP (7.62 mm (300))
PD78F0745MC-CAB-AX, 78F0746MC-CAB-AX, 78F0755MC-CAB-AX, 78F0756MC-CAB-AX
Soldering Method Soldering Conditions Recommended
Condition Symbol
Infrared reflow Package peak temperature: 260C, Time: 60 seconds max. (at 220C or higher),
Count: 3 times or less, Exposure limit: 7 days
Note
(after that, prebake at 125C for
10 to 72 hours)
IR60-107-3
Wave soldering Solder bath temperature: 260C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120C max. (package surface temperature), Exposure
limit: 7 days
Note
(after that, prebake at 125C for 10 to 72 hours)
WS60-107-1
Partial heating Pin temperature: 350C max., Time: 3 seconds max. (per pin row)
Note After opening the dry pack, store it at 25C or less and 65% RH or less for the allowable storage period.
Cautions 1. Do not use different soldering methods together (except for partial heating).
2. The 78K0/Ix2 microcontrollers have an on-chip debug function, which is provided for development
and evaluation. Do not use the on-chip debug function in products designated for mass production,
because the guaranteed number of rewritable times of the flash memory may be exceeded when this
function is used, and product reliability therefore cannot be guaranteed. Renesas Electronics is not
liable for problems occurring when the on-chip debug function is used.
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