Datasheet
78K0/Kx2-L CHAPTER 30 RECOMMENDED SOLDERING CONDITIONS
R01UH0028EJ0400 Rev.4.00 777
Sep 27, 2010
CHAPTER 30 RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact a Renesas Electronics
sales representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www2.renesas.com/pkg/en/mount/index.html)
Table 30-1. Surface Mounting Type Soldering Conditions
(1) 78K0/KY2-L, 78K0/KA2-L (20-pin products), 78K0/KB2-L, 78K0/KC2-L (44-pin and 48-pin products)
Soldering Method Soldering Conditions Recommended
Condition Symbol
Infrared reflow Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
Note
(after that, prebake at 125°C for
10 to 72 hours)
IR60-107-3
Partial heating Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
−
(2) 78K0/KA2-L (25-pin and 32-pin products), 78K0/KC2-L (40-pin products)
Soldering Method Soldering Conditions Recommended
Condition Symbol
Infrared reflow Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
Note
(after that, prebake at 125°C for
10 to 72 hours)
IR60-107-3
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Cautions 1. Do not use different soldering methods together (except for partial heating).
2. The 78K0/Kx2-L microcontrollers have an on-chip debug function, which is provided for
development and evaluation. Do not use the on-chip debug function in products designated for
mass production, because the guaranteed number of rewritable times of the flash memory may be
exceeded when this function is used, and product reliability therefore cannot be guaranteed.
Renesas Electronics is not liable for problems occurring when the on-chip debug function is used.
3. Solder the exposed pad of a 32 or 40-pin plastic WQFN package, and set the potential to the same
value as V
SS.
Exposed pad
32-PIN PLASTIC WQFN
40-PIN PLASTIC WQFN
<R>
<R>
<R>