Datasheet

28.5 RAM Retention Voltage Detection Operation.................................................................... 1346
CHAPTER 29 CRC FUNCTION.......................................................................................................... 1348
29.1 Functions .............................................................................................................................. 1348
29.2 Configuration........................................................................................................................ 1348
29.3 Registers ............................................................................................................................... 1349
29.4 Operation .............................................................................................................................. 1350
29.5 Usage Method....................................................................................................................... 1351
CHAPTER 30 REGULATOR ............................................................................................................... 1353
30.1 Overview ............................................................................................................................... 1353
30.2 Operation .............................................................................................................................. 1354
CHAPTER 31 FLASH MEMORY........................................................................................................ 1355
31.1 Features ................................................................................................................................ 1355
31.2 Memory Configuration......................................................................................................... 1356
31.3 Functional Overview ............................................................................................................ 1357
31.4 Rewriting by Dedicated Flash Programmer ...................................................................... 1360
31.4.1 Programming environment..........................................................................................................1360
31.4.2 Communication mode .................................................................................................................1361
31.4.3 Flash memory control .................................................................................................................1375
31.4.4 Selection of communication mode ..............................................................................................1376
31.4.5 Communication commands.........................................................................................................1377
31.4.6 Pin connection ............................................................................................................................1378
31.5 Rewriting by Self Programming.......................................................................................... 1382
31.5.1 Overview .....................................................................................................................................1382
31.5.2 Features......................................................................................................................................1383
31.5.3 Standard self programming flow .................................................................................................1384
31.5.4 Flash functions............................................................................................................................1385
31.5.5 Pin processing ............................................................................................................................1385
31.5.6 Internal resources used...............................................................................................................1386
31.6 Creating ROM code to place order for previously written product ................................ 1387
31.6.1 Procedure for using ROM code to place an order .......................................................................1387
CHAPTER 32 ON-CHIP DEBUG FUNCTION ................................................................................... 1388
32.1 Debugging with DCU ........................................................................................................... 1389
32.1.1 Connection circuit example ........................................................................................................1389
32.1.2 Interface signals .........................................................................................................................1389
32.1.3 Maskable functions.....................................................................................................................1391
32.1.4 Register......................................................................................................................................1391
32.1.5 Operation ...................................................................................................................................1393
32.1.6 Cautions .....................................................................................................................................1393
32.2 Debugging Without Using DCU .......................................................................................... 1394
32.2.1 Circuit connection examples.......................................................................................................1394
32.2.2 Maskable functions.....................................................................................................................1397
32.2.3 Securement of user resources ...................................................................................................1398
32.2.4 Cautions .....................................................................................................................................1405
32.3 ROM Security Function........................................................................................................ 1406
32.3.1 Security ID..................................................................................................................................1406
32.3.2 Setting ........................................................................................................................................1407
CHAPTER 33 ELECTRICAL SPECIFICATIONS............................................................................... 1409
33.1 Absolute Maximum Ratings ................................................................................................ 1409
33.2 Capacitance .......................................................................................................................... 1411
33.3 Operating Conditions .......................................................................................................... 1411
33.4 Oscillator Characteristics.................................................................................................... 1412
33.4.1 Main clock oscillator characteristics ............................................................................................1412
33.4.2 Subclock oscillator characteristics ..............................................................................................1414