Datasheet

V850ES/JG3-H, V850ES/JH3-H CHAPTER 35 RECOMMENDED SOLDERING CONDITIONS

R01UH0042EJ0500 Rev.5.00 Page 1447 of 1513

Aug 12, 2011

CHAPTER 35 RECOMMENDED SOLDERING CONDITIONS

These products should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, please contact a Renesas Electronics

sales representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www2.renesas.com/pkg/en/mount/index.html)

Remark Evaluation of the soldering conditions for the (A) standard products is incomplete because these products

are under development.

Table 35-1. Surface Mounting Type Soldering Conditions (1/2)

PD70F3760GC-UEU-AX: 100-pin plastic LQFP (fine pitch) (14 × 14 mm)

PD70F3761GC-UEU-AX: 100-pin plastic LQFP (fine pitch) (14 × 14 mm)

PD70F3762GC-UEU-AX: 100-pin plastic LQFP (fine pitch) (14 × 14 mm)

PD70F3770GC-UEU-AX: 100-pin plastic LQFP (fine pitch) (14 × 14 mm)

Soldering Method Soldering Conditions Recommended

Condition Symbol

Infrared reflow Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),

Count: 3 times or less, Exposure limit: 7 days

Note

(after that, prebake at 125°C for

20 to 72 hours)

IR60-207-3

Partial heating Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)

−

Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

Remarks 1. Products with –AX at the end of the part number are lead-free products.

2. For soldering methods and conditions other than those recommended, please contact a Renesas

Electronics sales representative.