Datasheet

V850ES/JG3 CHAPTER 31 RECOMMENDED SOLDERING CONDITIONS
R01UH0015EJ0300 Rev.3.00 Page 801 of 870
Sep 30, 2010
CHAPTER 31 RECOMMENDED SOLDERING CONDITIONS
The V850ES/JG3 should be soldered and mounted under the following recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http:// www2.renesas.com/pkg/en/mount/index.html)
Table 31-1. Surface Mounting Type Soldering Conditions
μ PD70F3739GC-UEU-AX: 100-pin plastic LQFP (fine pitch) (14 × 14)
μ PD70F3740GC-UEU-AX: 100-pin plastic LQFP (fine pitch) (14 × 14)
μ PD70F3741GC-UEU-AX: 100-pin plastic LQFP (fine pitch) (14 × 14)
μ PD70F3742GC-UEU-AX: 100-pin plastic LQFP (fine pitch) (14 × 14)
Soldering Method Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: Three times or less,
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 20 to 72 hours)
IR60-207-3
Partial heating Pin temperature: 350°C max., Time: 3 seconds max. (per pin row) –
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remarks 1. Products with -AX at the end of the part number are lead-free products.
2. For soldering methods and conditions other than those recommended above, please contact an Renesas
Electronics sales representative.