Datasheet

R01DS0098EJ0180 Rev.1.80 Page 134 of 208
May 13, 2014
RX63N Group, RX631 Group 5. Electrical Characteristics
Note 1. Supply current values are with all output pins unloaded and all input pull-up MOSs in the off state.
Note 2. Measured with clocks supplied to the peripheral functions. This does not include the BGO operation.
Note 3. I
CC
depends on f (ICLK) as follows. (ICLK:PCLK:BCLK:BCLK pin = 8:4:4:2)
I
CC
Max. = 0.87 × f + 13 (max. operation in high-speed operating mode)
I
CC
Typ. = 0.35 × f + 5 (normal operation in high-speed operating mode)
I
CC
Typ. = 1.0 × f + 3 (low-speed operating mode 1)
I
CC
Max. = 0.53 × f + 12 (sleep mode)
Note 4. This does not include the BGO operation.
Note 5. This is the increase for programming or erasure of the ROM or flash memory for data storage during program execution.
Note 6. Supply of the clock signal to peripherals is stopped in this state. This does not include the BGO operation.
Note 7. The reference power supply current is included in the power supply current value for 10-bit A/D conversion and D/A conversion.
Note 8. When V
BATT
is used
Note 9. The current values for 10-bit A/D converter and 10-bit D/A converter are included in the current from the VREFH pin.
Note 10. The values are the sum of I
AVCC0
and I
VREFH
.
RAM standby voltage V
RAM
2.7 — — V
VCC rising gradient SrVCC 8.4 — 20000 µs/V
VCC falling gradient*
8
SfVCC 8.4 — — µs/V
Table 5.4 DC Characteristics (3) (for D and G Versions (-40 ≤ Ta ≤ +85°C))
Conditions: VCC = AVCC0 = VREFH = VCC_USB = V
BATT
= 2.7 to 3.6 V, VREFH0 = 2.7 V to AVCC0,
VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V, T
a
= T
opr
Item Symbol Min. Typ. Max. Unit Test Conditions