Datasheet

R01DS0060EJ0160 Rev.1.60 Page 105 of 154
May 19, 2014
RX630 Group 5. Electrical Characteristics
Note 1. Supply current values are with all output pins unloaded and all input pull-up MOSs in the off state.
Note 2. Measured with clocks supplied to the peripheral functions. This does not include the BGO operation.
Note 3. I
CC
depends on f (ICLK) as follows. (ICLK:PCLK:BCLK:BCLK pin = 8:4:4:2)
I
CC
Max. = 0.87 × f + 13 (max. operation in high-speed operating mode)
I
CC
Typ. = 0.35 × f + 5 (normal operation in high-speed operating mode)
I
CC
Typ. = 1.0 × f + 3 (low-speed operating mode 1)
I
CC
Max. = 0.48 × f + 12 (sleep mode)
Note 4. This does not include the BGO operation.
Note 5. This is the increase for programming or erasure of the ROM or flash memory for data storage during program execution.
Note 6. Supply of the clock signal to peripherals is stopped in this state. This does not include the BGO operation.
Note 7. The current values for 10-bit A/D converter and 10-bit D/A converter are included in the current from the VREFH pin.
Note 8. The values are the sum of I
AVCC0
and I
VREFH
.
Table 5.4 DC Characteristics (3) (for D and G Versions (-40 ≤ Ta ≤ +85°C))
Conditions: VCC = AVCC0 = VREFH = VCC_USB = V
BATT
= 2.7 to 3.6 V, VREFH0 = 2.7 V to AVCC0,
VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V, T
a
= T
opr
Item Symbol Min. Typ. Max. Unit Test Conditions
Supply
current*
1
High-speed operating mode
Max.*
2
I
CC
*
3
— — 100 mA ICLK = 100 MHz
PCLKB = 50 MHz
FCLK = 50 MHz
BCLK = 50 MHz
Normal Peripheral function: clock signal
supplied*
4
—52—
Peripheral function: clock signal
stopped*
4
—40—
Sleep mode — 25 60
All-module-clock-stop mode (reference value) — 20 30
Increased by BGO operation*
5
—15—
Low-speed operating mode 1*
6
— 4 — ICLK = 1 MHz
Low-speed operating mode 2 — 1 — ICLK = 32.768 kHz
Software standby mode — 0.2 6
Deep software standby mode
Power supplied to RAM and USB resume
detecting unit
— 22 200 µA
Power not supplied
to RAM and USB
resume detecting
unit
Power-on reset circuit
and low-power function
enabled consumption
function disabled
—2160
Power-on reset circuit
and low-power function
enabled consumption
function enabled
—6.228
Increased by RTC operation — 3 —
RTC operation when VCC is off — 1.7 — V
BATT
= 2.3 V
—3.3— V
BATT
= 3.3 V
Analog power
supply
current*
7
During 12-bit A/D conversion (including temperature
sensor)
I
AVCC0
— 2.3 3.2 mA
During 10-bit A/D conversion I
VREFH
*
7
— 1.0 1.65 mA
During D/A conversion (per unit) — 0.7 1.0 mA
Waiting for A/D, D/A conversion (all units)*
8
— — 25 35 µA
A/D, D/A converter in standby mode (all units)*
8
— 0.1 4.0 µA
Reference
power supply
current
During 12-bit A/D conversion I
VREFH0
— 0.6 0.7 mA
Waiting for 12-bit A/D conversion (per unit) — 0.5 0.6 mA
12-bit A/D converter in standby mode (per unit) — 0.1 2.0 µA
RAM standby voltage V
RAM
2.7 — — V
VCC rising gradient SrVCC 8.4 — 20000 µs/V
VCC falling gradient*
8
SfVCC 8.4 — — µs/V