Datasheet

Rev.3.00 Feb 29, 2008 Page 1 of 51
REJ03B0117-0300
R8C/24 Group, R8C/25 Group
SINGLE-CHIP 16-BIT CMOS MCU
1. Overview
These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series
CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements
sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capable of
executing instructions at high speed.
Furthermore, the R8C/25 Group has on-chip data flash (1 KB x 2 blocks).
The difference between the R8C/24 Group and R8C/25 Group is only the presence or absence of data flash. Their
peripheral functions are the same.
1.1 Applications
Electronic household appliances, office equipment, audio equipment, consumer products, etc.
REJ03B0117-0300
Rev.3.00
Feb 29, 2008