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To our customers,

Old Company Name in Catalogs and Other Documents

On April 1

, 2010, NEC Electronics Corporation merged with Renesas Technology

Corporation, and Renesas Electronics Corporation took over all the business of both

companies. Therefore, although the old company name remains in this document, it is a valid

Renesas Electronics document. We appreciate your understanding.

Renesas Electronics website: http://www.renesas.com

April 1

, 2010

Renesas Electronics Corporation

Issued by: Renesas Electronics Corporation (http://www.renesas.com)

Send any inquiries to http://www.renesas.com/inquiry

Summary of content (47 pages)

PAGE 1
To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.
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Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office.
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R8C/20 Group, R8C/21 Group RENESAS MCU 1. REJ03B0120-0200 Rev.2.00 Aug 27, 2008 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte of address space, it is capable of executing instructions at high speed. This Furthermore, the data flash (1 KB x 2 blocks) is embedded in the R8C/21 Group.
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R8C/20 Group, R8C/21 Group 1.2 1. Overview Performance Overview Table 1.1 outlines the Functions and Specifications for R8C/20 Group and Table 1.2 outlines the Functions and Specifications for R8C/21 Group. Table 1.1 Functions and Specifications for R8C/20 Group Item Specification Number of fundamental instructions 89 instructions Minimum instruction execution time 50 ns (f(XIN) = 20 MHz, VCC = 3.0 to 5.5 V) 100 ns (f(XIN) = 10 MHz, VCC = 2.7 to 5.
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R8C/20 Group, R8C/21 Group Table 1.2 1. Overview Functions and Specifications for R8C/21 Group Item Specification Number of fundamental instructions 89 instructions Minimum instruction execution time 50 ns (f(XIN) = 20 MHz, VCC = 3.0 to 5.5 V) 100 ns (f(XIN) = 10 MHz, VCC = 2.7 to 5.5 V) Operating mode Single-chip Address space 1 Mbyte Memory capacity Refer to Table 1.
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R8C/20 Group, R8C/21 Group 1.3 1. Overview Block Diagram Figure 1.1 shows a Block Diagram.
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R8C/20 Group, R8C/21 Group 1.4 1. Overview Product Information Table 1.3 lists Product Information for R8C/20 Group and Table 1.4 lists Product Information for R8C/21 Group. Table 1.3 Product Information for R8C/20 Group Type No. R5F21206JFP R5F21207JFP R5F21208JFP R5F2120AJFP R5F2120CJFP ROM Capacity 32 Kbytes 48 Kbytes 64 Kbytes 96 Kbytes 128 Kbytes(1) 32 Kbytes 48 Kbytes 64 Kbytes 96 Kbytes R5F21206KFP R5F21207KFP R5F21208KFP R5F2120AKFP R5F2120CKFP 128 Kbytes(1) Current of Aug.
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R8C/20 Group, R8C/21 Group Table 1.4 1. Overview Product Information for R8C/21 Group ROM Capacity Program ROM Data Flash 32 Kbytes 1 Kbyte X 2 48 Kbytes 1 Kbyte X 2 64 Kbytes 1 Kbyte X 2 96 Kbytes 1 Kbyte X 2 128 Kbytes(1) 1 Kbyte X 2 Type No. R5F21216JFP R5F21217JFP R5F21218JFP R5F2121AJFP R5F2121CJFP R5F21216KFP R5F21217KFP R5F21218KFP R5F2121AKFP R5F2121CKFP 32 Kbytes 48 Kbytes 64 Kbytes 96 Kbytes 1 Kbyte X 2 1 Kbyte X 2 1 Kbyte X 2 1 Kbyte X 2 (1) 1 Kbyte X 2 128 Kbytes Current of Aug.
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R8C/20 Group, R8C/21 Group 1.5 1. Overview Pin Assignments P0_7/AN0 P6_3 P6_4 P6_5 P3_0/TRAO P3_1/TRBO P1_0/KI0/AN8 P1_1/KI1/AN9 P1_2/KI2/AN10 P6_7/INT3/RXD1 P6_6/INT2/TXD1 P4_5/INT0 36 35 34 33 32 31 30 29 28 27 26 25 Figure 1.4 shows Pin Assignments (Top View).
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R8C/20 Group, R8C/21 Group 1.6 1. Overview Pin Functions Table 1.5 lists the Pin Functions and Table 1.6 lists the Pin Name Information by Pin Number. Table 1.5 Pin Functions Type Symbol I/O Type Description Power Supply Input VCC VSS I Apply 2.7 V to 5.5 V to the VCC pin. Apply 0 V to the VSS pin. Analog Power Supply Input AVCC, AVSS I Applies the power supply for the A/D converter. Connect a capacitor between AVCC and AVSS. Reset Input RESET I Input “L” on this pin resets the MCU.
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R8C/20 Group, R8C/21 Group Table 1.6 Pin Name Information by Pin Number Pin Control Pin Number 1 2 3 4 5 6 7 1.
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R8C/20 Group, R8C/21 Group 2. 2. Central Processing Unit (CPU) Central Processing Unit (CPU) Figure 2.1 shows the CPU Registers. The CPU contains 13 registers. Of these, R0, R1, R2, R3, A0, A1, and FB comprise a register bank. Two sets of register banks are provided.
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R8C/20 Group, R8C/21 Group 2.1 2. Central Processing Unit (CPU) Data Registers (R0, R1, R2 and R3) R0 is a 16-bit register for transfer, arithmetic, and logic operations. The same applies to R1 to R3. R0 can be split into high-order bit (R0H) and low-order bit (R0L) to be used separately as 8-bit data registers. The same applies to R1H and R1L as R0H and R0L. R2 can be combined with R0 to be used as a 32-bit data register (R2R0). The same applies R3R1 as R2R0. 2.
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R8C/20 Group, R8C/21 Group 2.8.7 2. Central Processing Unit (CPU) Interrupt Enable Flag (I) The I flag enables a maskable interrupt. An interrupt is disabled when the I flag is set to 0, and are enabled when the I flag is set to 1. The I flag is set to 0 when an interrupt request is acknowledged. 2.8.8 Stack Pointer Select Flag (U) ISP is selected when the U flag is set to 0; USP is selected when the U flag is set to 1.
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R8C/20 Group, R8C/21 Group 3. 3. Memory Memory 3.1 R8C/20 Group Figure 3.1 shows a Memory Map of R8C/20 Group. The R8C/20 Group has 1 Mbyte of address space from address 00000h to FFFFFh. The internal ROM is allocated lower addresses, beginning with address 0FFFFh. For example, a 48-Kbyte internal ROM is allocated addresses 04000h to 0FFFFh. The fixed interrupt vector table is allocated addresses 0FFDCh to 0FFFFh. They store the starting address of each interrupt routine.
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R8C/20 Group, R8C/21 Group 3.2 3. Memory R8C/21 Group Figure 3.2 shows a Memory Map of R8C/21 Group. The R8C/21 Group has 1 Mbyte of address space from address 00000h to FFFFFh. The internal ROM (program ROM) is allocated lower addresses, beginning with address 0FFFFh. For example, a 48-Kbyte internal ROM is allocated addresses 04000h to 0FFFFh. The fixed interrupt vector table is allocated addresses 0FFDCh to 0FFFFh. They store the starting address of each interrupt routine.
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R8C/20 Group, R8C/21 Group 4. 4. Special Function Registers (SFRs) Special Function Registers (SFRs) An SFR (special function register) is a control register for a peripheral function. Table 4.1 to Table 4.6 list the SFR Information. Table 4.
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R8C/20 Group, R8C/21 Group Table 4.2 Address 0040h 0041h 0042h 0043h 0044h 0045h 0046h 0047h 0048h 0049h 004Ah 004Bh 004Ch 004Dh 004Eh 004Fh 0050h 0051h 0052h 0053h 0054h 0055h 0056h 0057h 0058h 0059h 005Ah 005Bh 005Ch 005Dh 005Eh 005Fh 0060h 0061h 0062h 0063h 0064h 0065h 0066h 0067h 0068h 0069h 006Ah 006Bh 006Ch 006Dh 006Eh 006Fh 0070h 0071h 0072h 0073h 0074h 0075h 0076h 0077h 0078h 0079h 007Ah 007Bh 007Ch 007Dh 007Eh 007Fh 4.
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R8C/20 Group, R8C/21 Group Table 4.3 Address 0080h 0081h 0082h 0083h 0084h 0085h 0086h 0087h 0088h 0089h 008Ah 008Bh 008Ch 008Dh 008Eh 008Fh 0090h 0091h 0092h 0093h 0094h 0095h 0096h 0097h 0098h 0099h 009Ah 009Bh 009Ch 009Dh 009Eh 009Fh 00A0h 00A1h 00A2h 00A3h 00A4h 00A5h 00A6h 00A7h 00A8h 00A9h 00AAh 00ABh 00ACh 00ADh 00AEh 00AFh 00B0h 00B1h 00B2h 00B3h 00B4h 00B5h 00B6h 00B7h 00B8h 00B9h 00BAh 00BBh 00BCh 00BDh 00BEh 00BFh 4.
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R8C/20 Group, R8C/21 Group Table 4.4 Address 00C0h 00C1h 00C2h 00C3h 00C4h 00C5h 00C6h 00C7h 00C8h 00C9h 00CAh 00CBh 00CCh 00CDh 00CEh 00CFh 00D0h 00D1h 00D2h 00D3h 00D4h 00D5h 00D6h 00D7h 00D8h 00D9h 00DAh 00DBh 00DCh 00DDh 00DEh 00DFh 00E0h 00E1h 00E2h 00E3h 00E4h 00E5h 00E6h 00E7h 00E8h 00E9h 00EAh 00EBh 00ECh 00EDh 00EEh 00EFh 00F0h 00F1h 00F2h 00F3h 00F4h 00F5h 00F6h 00F7h 00F8h 00F9h 00FAh 00FBh 00FCh 00FDh 00FEh 00FFh 4.
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R8C/20 Group, R8C/21 Group Table 4.5 Address 0100h 0101h 0102h 0103h 0104h 0105h 0106h 0107h 0108h 0109h 010Ah 010Bh 010Ch 010Dh 010Eh 010Fh 0110h 0111h 0112h 0113h 0114h 0115h 0116h 0117h 0118h 0119h 011Ah 011Bh 011Ch 011Dh 011Eh 011Fh 0120h 0121h 0122h 0123h 0124h 0125h 0126h 0127h 0128h 0129h 012Ah 012Bh 012Ch 012Dh 012Eh 012Fh 0130h 0131h 0132h 0133h 0134h 0135h 0136h 0137h 0138h 0139h 013Ah 013Bh 013Ch 013Dh 013Eh 013Fh 4.
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R8C/20 Group, R8C/21 Group Table 4.6 Address 0140h 0141h 0142h 0143h 0144h 0145h 0146h 0147h 0148h 0149h 014Ah 014Bh 014Ch 014Dh 014Eh 014Fh 0150h 0151h 0152h 0153h 0154h 0155h 0156h 0157h 0158h 0159h 015Ah 015Bh 015Ch 015Dh 015Eh 015Fh 01B0h 01B1h 01B2h 01B3h 01B4h 01B5h 01B6h 01B7h 01B8h 01B9h 01BAh 01BBh 01BCh 01BDh 01BEh 01BFh FFFFh 4.
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R8C/20 Group, R8C/21 Group 5. 5. Electrical Characteristics Electrical Characteristics Table 5.1 Absolute Maximum Ratings Symbol Parameter Rated value Unit -0.3 to 6.5 V Input voltage -0.3 to VCC+0.3 V VO Output voltage -0.3 to VCC+0.3 V Pd Power dissipation 300 mW Topr Operating ambient temperature Tstg Storage temperature VCC/AVCC Supply voltage VI Condition -40°C ≤ Topr ≤ 85°C 85°C < Topr ≤ 125°C Table 5.
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R8C/20 Group, R8C/21 Group Table 5.3 5. Electrical Characteristics A/D Converter Characteristics Symbol Parameter − Resolution − Absolute Accuracy Rladder Resistor ladder tconv Conversion time Conditions Standard Min. Typ. Max. Unit Vref = AVCC − − 10 Bits 10-bit mode φAD = 10 MHz, Vref = AVCC = 5.0 V − − ±3 LSB 8-bit mode φAD = 10 MHz, Vref = AVCC = 5.0 V − − ±2 LSB 10-bit mode φAD = 10 MHz, Vref = AVCC = 3.3 V − − ±5 LSB 8-bit mode φAD = 10 MHz, Vref = AVCC = 3.
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R8C/20 Group, R8C/21 Group Table 5.4 Flash Memory (Program ROM) Electrical Characteristics Symbol − 5. Electrical Characteristics Parameter Program/erase endurance(2) Conditions Standard Unit Min. Typ. Max. R8C/20 Group 100(3) − − times R8C/21 Group 1,000(3) − − times µs − Byte program time − 50 400 − Block erase time − 0.
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R8C/20 Group, R8C/21 Group Table 5.5 5. Electrical Characteristics Flash Memory (Data Flash Block A, Block B) Electrical Characteristics(4) Symbol Parameter Conditions Standard Min. Typ. Max. Unit − Program/erase endurance(2) 10,000(3) − − times − Byte program time (Program/erase endurance ≤ 1,000 times) − 50 400 µs − Byte program time (Program/erase endurance > 1,000 times) − 65 − µs − Block erase time (Program/erase endurance ≤ 1,000 times) − 0.
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R8C/20 Group, R8C/21 Group 5. Electrical Characteristics Suspend request (Maskable interrupt request) FMR46 Fixed time Clock-dependent time Access restart td(SR-SUS) Figure 5.2 Table 5.
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R8C/20 Group, R8C/21 Group Table 5.8 5. Electrical Characteristics Power-on Reset Circuit, Voltage Monitor 1 Reset Circuit Electrical Characteristics(3) Symbol Parameter Condition Standard Min. Typ. Unit Max. Vpor1 Power-on reset valid voltage(4) − − 0.1 V Vpor2 Power-on reset or voltage monitor 1 valid voltage 0 − Vdet1 V trth External power VCC rise gradient VCC ≤ 3.6 V 20(2) − − mV/msec VCC > 3.6 V 20(2) − 2,000 mV/msec NOTES: 1.
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R8C/20 Group, R8C/21 Group Table 5.9 High-Speed On-Chip Oscillator Circuit Electrical Characteristics Symbol fOCO40M 5. Electrical Characteristics Parameter High-speed on-chip oscillator frequency temperature • supply voltage dependence − The value of the FRA1 register when the reset is deasserted − High-speed on-chip oscillator adjustment range − Oscillation stability time − Self power consumption when high-speed on-chip oscillator oscillating Condition Standard Unit Min. Typ. Max.
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R8C/20 Group, R8C/21 Group Table 5.12 5. Electrical Characteristics Timing Requirements of Clock Synchronous Serial I/O with Chip Select(1) Symbol Parameter Conditions Standard Min. Typ. Unit Max. tSUCYC SSCK clock cycle time 4 − − tCYC(2) tHI SSCK clock “H” width 0.4 − 0.6 tSUCYC tLO SSCK clock “L” width tRISE SSCK clock rising time 0.4 − 0.
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R8C/20 Group, R8C/21 Group 5.
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R8C/20 Group, R8C/21 Group 5.
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R8C/20 Group, R8C/21 Group 5. Electrical Characteristics tHI VIH or VOH SSCK VIH or VOH tLO tSUCYC SSO (output) tOD SSI (input) tSU Figure 5.6 tH I/O Timing of Clock Synchronous Serial I/O with Chip Select (Clock Synchronous Communication Mode) Rev.2.
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R8C/20 Group, R8C/21 Group Table 5.13 5. Electrical Characteristics Timing Requirements of I2C Bus Interface(1) Symbol Parameter Conditions Standard Typ. − Max. − − − ns − − ns − 300 − ns ns Unit tSCL SCL input cycle time tSCLH SCL input “H” width tSCLL SCL input “L” width tsf tSP SCL, SDA input falling time SCL, SDA input spike pulse rejection time Min.
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R8C/20 Group, R8C/21 Group Table 5.14 Electrical Characteristics (1) [VCC = 5 V] Symbol VOH 5. Electrical Characteristics IOH = -1 mA Standard Min. Typ. VCC − 2.0 − VCC − 0.3 − VCC − 2.0 − Max. VCC VCC VCC IOH = -500 µA VCC − 2.0 − VCC V − − − − IOL = 1 mA − − 2.0 0.45 2.0 V V V IOL = 500 µA − − 2.0 V INT0, INT1, INT2, INT3, KI0, KI1, KI2, KI3, TRAIO, RXD0, RXD1, CLK0, SSI, SCL, SDA, SSO 0.1 0.5 − V RESET 0.1 1.0 − V − − − 30 − 50 1.0 5.0 -5.
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R8C/20 Group, R8C/21 Group Table 5.15 Symbol ICC 5. Electrical Characteristics Electrical Characteristics (2) [VCC = 5 V] (Topr = -40 to 85°C (J version) / -40 to 125°C (K version), Unless Otherwise Specified.) Parameter Condition Power supply current High-clock (VCC = 3.3 to 5.5 V) mode In single-chip mode, the output pins are open and other pins are VSS Rev.2.
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R8C/20 Group, R8C/21 Group 5. Electrical Characteristics Timing Requirements (Unless Otherwise Specified: VCC = 5 V, VSS = 0 V at Topr = 25°C) [VCC = 5 V] XIN Input Table 5.16 Symbol tc(XIN) tWH(XIN) tWL(XIN) Standard Min. Max. 50 − 25 − 25 − Parameter XIN input cycle time XIN input “H” width XIN input “L” width Unit ns ns ns Vcc = 5V tc(XIN) tWH(XIN) XIN input tWL(XIN) Figure 5.8 Table 5.17 XIN Input Timing Diagram when VCC = 5 V TRAIO Input Symbol tc(TRAIO) tWH(TRAIO) tWL(TRAIO) Standard Min.
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R8C/20 Group, R8C/21 Group Table 5.18 5. Electrical Characteristics Serial Interface Symbol Standard Min. Max. 200 − 100 − 100 − − 50 0 − 50 − 90 − Parameter tc(CK) tW(CKH) tW(CKL) td(C-Q) th(C-Q) tsu(D-C) th(C-D) CLK0 input cycle time CLK0 input “H” width CLK0 input “L” width TXDi output delay time TXDi hold time RXDi input setup time RXDi input hold time Unit ns ns ns ns ns ns ns i = 0 or 1 Vcc = 5V tc(CK) tW(CKH) CLK0 tW(CKL) th(C-Q) TXDi td(C-Q) tsu(D-C) th(C-D) RXDi i = 0 or 1 Figure 5.
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R8C/20 Group, R8C/21 Group Table 5.20 Electrical Characteristics (3) [VCC = 3 V] Symbol VOH VOL VT+-VT- IIH IIL RPULLUP RfXIN VRAM 5. Electrical Characteristics Parameter Output “H” voltage Output “L” voltage Hysteresis Input “H” current Input “L” current Pull-up resistance Feedback resistance RAM hold voltage Except XOUT XOUT IOH = -0.1 mA Standard Min. Typ. VCC − 0.5 − VCC − 0.5 − Max. VCC VCC IOH = -50 µA VCC − 0.
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R8C/20 Group, R8C/21 Group Table 5.21 Symbol ICC 5. Electrical Characteristics Electrical Characteristics (4) [VCC = 3 V] (Topr = -40 to 85°C (J version) / -40 to 125°C (K version), Unless Otherwise Specified.) Parameter Condition Power supply current High-clock (VCC = 2.7 to 3.3 V) mode In single-chip mode, the output pins are open and other pins are VSS Rev.2.
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R8C/20 Group, R8C/21 Group 5. Electrical Characteristics Timing Requirements (Unless Otherwise Specified: VCC = 3 V, VSS = 0V at Topr = 25°C) [VCC = 3 V] Table 5.22 XIN Input Symbol tc(XIN) tWH(XIN) tWL(XIN) Standard Min. Max. 100 − 40 − 40 − Parameter XIN input cycle time XIN input “H” width XIN input “L” width Unit ns ns ns Vcc = 3V tc(XIN) tWH(XIN) XIN input tWL(XIN) Figure 5.12 Table 5.23 XIN Input Timing Diagram when VCC = 3 V TRAIO Input Symbol tc(TRAIO) tWH(TRAIO) tWL(TRAIO) Standard Min.
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R8C/20 Group, R8C/21 Group Table 5.24 5. Electrical Characteristics Serial Interface Symbol Standard Min. Max. 300 − 150 − 150 − − 80 0 − 70 − 90 − Parameter tc(CK) tW(CKH) tW(CKL) td(C-Q) th(C-Q) tsu(D-C) th(C-D) CLK0 input cycle time CLK0 input “H” width CLK0 input “L” width TXDi output delay time TXDi hold time RXDi input setup time RXDi input hold time Unit ns ns ns ns ns ns ns i = 0 or 1 Vcc = 3V tc(CK) tW(CKH) CLK0 tW(CKL) th(C-Q) TXDi td(C-Q) tsu(D-C) th(C-D) RXDi i = 0 or 1 Figure 5.
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R8C/20 Group, R8C/21 Group Package Dimensions Package Dimensions Diagrams showing the latest package dimensions and mounting information are available in the “Packages” section of the Renesas Technology website. JEITA Package Code P-LQFP48-7x7-0.50 RENESAS Code PLQP0048KB-A Previous Code 48P6Q-A MASS[Typ.] 0.2g HD *1 D 36 25 37 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.
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REVISION HISTORY R8C/20 Group, R8C/21 Group Datasheet Description Rev. Date 0.10 Mar 08, 2005 − First Edition issued 0.20 Sep 29, 2005 − Words standardized - Clock synchronous serial interface → Clock synchronous serial I/O - Chip-select clock synchronous interface(SSU) → Clock synchronous serial I/O with chip select - I2C bus interface(IIC) → I2C bus interface Page Summary 2, 3 Table1.1 R8C/20 Group Performance, Table1.
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REVISION HISTORY Rev. Date 0.20 Sep 29, 2005 1.00 Nov 15, 2006 R8C/20 Group, R8C/21 Group Datasheet Description Page Summary 20 Table 4.
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REVISION HISTORY Rev. Date 1.00 Nov 15, 2006 2.00 Aug 27, 2008 R8C/20 Group, R8C/21 Group Datasheet Description Page Summary 33 Table 5.15 Electrical Characteristics (1) [VCC = 5 V] → Table 5.14 Electrical Characteristics (1) [VCC = 5 V] revised. RAM Hold Voltage, Min.; “1.8” → “2.0” corrected. 34 Table 5.16 Electrical Characteristics (2) [Vcc = 5 V] → Table 5.15 Electrical Characteristics (2) [Vcc = 5 V] revised. Wait mode revised. 37 Table 5.
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Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Notes: 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use.