Datasheet

RL78/L12
CHAPTER 31 ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105°C)
R01UH0330EJ0200 Rev.2.00 927
Dec 13, 2013
Notes 1. Total current flowing into VDD and EVDD, including the input leakage current flowing when the level of the input
pin is fixed to VDD, EVDD or VSS, EVSS. The values below the MAX. column include the peripheral operation
current. However, not including the current flowing into the A/D converter, LVD circuit, I/O port, and on-chip
pull-up/pull-down resistors and the current flowing during data flash rewrite.
2. During HALT instruction execution by flash memory.
3. When high-speed on-chip oscillator and subsystem clock are stopped.
4. When high-speed system clock and subsystem clock are stopped.
5. When high-speed on-chip oscillator and high-speed system clock are stopped. When RTCLPC = 1 and setting
ultra-low current consumption (AMPHS1 = 1). The current flowing into the RTC is included. However, not
including the current flowing into the 12-bit interval timer, watchdog timer, and LCD controller/driver.
6. Not including the current flowing into the RTC, 12-bit interval timer, and watchdog timer.
7. Relationship between operation voltage width, operation frequency of CPU and operation mode is as below.
HS (high-speed main) mode: 2.7 V ≤ V
DD ≤ 5.5 V@1 MHz to 24 MHz
2.4 V ≤ VDD ≤ 5.5 V@1 MHz to 16 MHz
8. Regarding the value for current operate the subsystem clock in STOP mode, refer to that in HALT mode.
Remarks 1. f
MX: High-speed system clock frequency (X1 clock oscillation frequency or external main system clock
frequency)
2. f
IH: High-speed on-chip oscillator clock frequency
3. fSUB: Subsystem clock frequency (XT1 clock oscillation frequency)
4. Except subsystem clock operation and STOP mode, temperature condition of the TYP. value is T
A = 25°C