Datasheet
RL78/G14 1. OUTLINE
R01DS0053EJ0200 Rev. 2.00 Page 3 of 187
Oct 25, 2013
1.2 Ordering Information
Figure 1 - 1 Part Number, Memory Size, and Package of RL78/G14
Note Products only for “A: Consumer applications (TA = -40 to +85 C)”
Fields of application:
A: Consumer applications, T
A = -40 to +85 C
D: Industrial applications, T
A = -40 to +85 C
G: Industrial applications, T
A = -40 to +105 C
Packaging specification
#U0: Tray (HWQFN, WFLGA, FLGA)
#V0: Tray (LFQFP, LQFP, LSSOP)
#W0:Embossed Tape (HWQFN, WFLGA, FLGA)
#X0: Embossed Tape (LFQFP, LQFP, LSSOP)
R 5 F 1 0 4 L E A x x x F B # V 0
Package type:
SP:LSSOP, 0.65 mm pitch
FP: LQFP, 0.80 mm pitch
FA: LQFP, 0.65 mm pitch
FB: LFQFP, 0.50 mm pitch
NA:HWQFN, 0.50 mm pitch
LA: WFLGA, 0.50 mm pitch
Note
LA: FLGA, 0.50 mm pitch
Note
ROM number (Omitted with blank products)
ROM capacity:
A: 16 KB
C: 32 KB
D: 48 KB
E: 64 KB
F: 96 KB
G: 128 KB
H: 192 KB
J: 256 KB
Pin count:
A: 30-pin
B: 32-pin
C: 36-pin
Note
E: 40-pin
F: 44-pin
G: 48-pin
J: 52-pin
L: 64-pin
M: 80-pin
P: 100-pin
RL78/G14
Memory type:
F : Flash memory
Renesas MCU
Renesas semiconductor product
Part No.