Datasheet

RL78/G14 3. ELECTRICAL SPECIFICATIONS (G: TA = -40 to +105 C)
R01DS0053EJ0200 Rev. 2.00 Page 122 of 187
Oct 25, 2013
Note 1. Total current flowing into VDD and EVDD0, including the input leakage current flowing when the level of the input pin is
fixed to V
DD, EVDD0 or VSS, EVSS0. The values below the MAX. column include the peripheral operation current.
However, not including the current flowing into the A/D converter, LVD circuit, I/O port, and on-chip pull-up/pull-down
resistors and the current flowing during data flash rewrite.
Note 2. When high-speed on-chip oscillator and subsystem clock are stopped.
Note 3. When high-speed system clock and subsystem clock are stopped.
Note 4. When high-speed on-chip oscillator and high-speed system clock are stopped. When AMPHS1 = 1 (Ultra-low power
consumption oscillation). However, not including the current flowing into the RTC, 12-bit interval timer, and watchdog
timer.
Note 5. Relationship between operation voltage width, operation frequency of CPU and operation mode is as below.
HS (high-speed main) mode: 2.7 V
 VDD  5.5 V@1 MHz to 32 MHz
2.4 V
 VDD  5.5 V@1 MHz to 16 MHz
Remark 1. fMX: High-speed system clock frequency (X1 clock oscillation frequency or external main system clock frequency)
Remark 2. fHOCO: High-speed on-chip oscillator clock frequency (64 MHz max.)
Remark 3. fIH: High-speed on-chip oscillator clock frequency (32 MHz max.)
Remark 4. fSUB: Subsystem clock frequency (XT1 clock oscillation frequency)
Remark 5. Except subsystem clock operation, temperature condition of the TYP. value is TA = 25°C