Datasheet

RL78/G12 1. OUTLINE
R01DS0193EJ0200 Rev.2.00
Sep 06, 2013
Page 3 of 106
1.2 List of Part Numbers
Figure 1-1. Part Number, Memory Size, and Package of RL78/G12
Part No. R 5 F 1 0 2 A A A x x x S P #V0
Package type:
ROM number (Omitted with blank products)
ROM capacity:
RL78/G12 group
Renesas MCU
Renesas semiconductor product
SP : LSSOP, 0.65 mm pitch
NA : HWQFN, 0.50 mm pitch
#U0 : Tray (HWQFN)
#V0 : Tray (LSSOP30), Tube (LSSOP20)
#W0: Embossed Tape (HWQFN)
#X0 : Embossed Tape (LSSOP30, LSSOP20)
6
: 2 KB
7
: 4 KB
8
: 8 KB
9
: 12 KB
A
: 16 KB
Pin count:
6 : 20-pin
7
: 24-pin
A
: 30-pin
Classification:
A : Consumer applications, T
A
= -40˚C to +85˚C
D : Industrial applications, T
A
= -40˚C to +85˚C
G : Industrial applications, T
A
= -40˚C to +105˚C
Memory type:
F : Flash memory
Packaging specifications:
102
Note 1
103
Notes 1, 2
Notes 1. For details about the differences between the R5F102 products and the R5F103 products of RL78/G12,
see 1.3 Differences between the R5F102 Products and the R5F103 Products.
2. Products only for "A: Consumer applications (T
A = -40 to +85°C)" and "D: Industrial applications (TA = -40 to
+85°C)"
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