Datasheet

RL78/G13 1. OUTLINE
Page 3 of 194R01DS0131EJ0310 Rev.3.10
Nov 15, 2013
1.2 List of Part Numbers
Figure 1-1. Part Number, Memory Size, and Package of RL78/G13
Part No. R 5 F 1 0 0 L E A x x x F B #V0
Package type:
Packaging specification
ROM number (Omitted with blank products)
ROM capacity:
RL78/G13 group
Renesas MCU
Renesas semiconductor product
SP : LSSOP, 0.65 mm pitch
FP : LFQFP, 0.80 mm pitch
#U0 : Tray (HWQFN,VFBGA,WFLGA)
#V0 : Tray (LFQFP,LQFP,LSSOP)
#W0 : Embossed Tape (HWQFN,VFBGA,WFLGA)
#X0 : Embossed Tape (LFQFP, LQFP, LSSOP)
FA : LFQFP, 0.65 mm pitch
FB : LFQFP, 0.50 mm pitch
NA : HWQFN, 0.50 mm pitch
LA : WFLGA, 0.50 mm pitch
BG : VFBGA, 0.40 mm pitch
A
: 16 KB
C
: 32 KB
D
: 48 KB
E
: 64 KB
F
: 96 KB
G : 128 KB
H : 192 KB
J : 256 KB
K : 384 KB
L : 512 KB
Pin count:
6 : 20-pin
7
: 24-pin
8
: 25-pin
A
: 30-pin
B
: 32-pin
C
: 36-pin
E
: 40-pin
F
: 44-pin
G : 48-pin
J : 52-pin
L : 64-pin
M : 80-pin
P
: 100-pin
S
: 128-pin
Fields of application:
A : Consumer applications, operating ambient temperature : -40˚C to +85˚C
D : Industrial applications, operating ambient temperature : -40˚C to +85˚C
G : Industrial applications, operating ambient temperature : -40˚C to +105˚C
Memory type:
F : Flash memory
Note 1
Note 1
Note 2
Note 2
Note 1
Note 1
Note 2
Note 2
Notes 1. Products only for “A: Consumer applications (T
A = −40 to +85°C)”
2. Products only for “A: Consumer applications (T
A = −40 to +85°C)”, and ” D: Industrial applications
(T
A = −40 to +85°C)