Datasheet

RL78/G13 3. ELECTRICAL SPECIFICATIONS (G: T
A = -40 to +105°C)
Page 133 of 194R01DS0131EJ0310 Rev.3.10
Nov 15, 2013
Notes 1. Total current flowing into VDD and EVDD0, including the input leakage current flowing when the level of the
input pin is fixed to V
DD, EVDD0 or VSS, EVSS0. The values below the MAX. column include the peripheral
operation current. However, not including the current flowing into the A/D converter, LVD circuit, I/O port,
and on-chip pull-up/pull-down resistors and the current flowing during data flash rewrite.
2. When high-speed on-chip oscillator and subsystem clock are stopped.
3. When high-speed system clock and subsystem clock are stopped.
4. When high-speed on-chip oscillator and high-speed system clock are stopped. When AMPHS1 = 1
(Ultra-low power consumption oscillation).
However, not including the current flowing into the RTC, 12-
bit interval timer, and watchdog timer.
5. Relationship between operation voltage width, operation frequency of CPU and operation mode is as
below.
HS (high-speed main) mode: 2.7 V ≤ V
DD ≤ 5.5 V@1 MHz to 32 MHz
2.4 V ≤ V
DD ≤ 5.5 V@1 MHz to 16 MHz
Remarks 1. f
MX: High-speed system clock frequency (X1 clock oscillation frequency or external main system
clock frequency)
2. f
IH: High-speed on-chip oscillator clock frequency
3. fSUB: Subsystem clock frequency (XT1 clock oscillation frequency)
4. Except subsystem clock operation, temperature condition of the TYP. value is T
A = 25°C