Datasheet

Page xxx of xxx
26.1.5 D/A Conversion Characteristics ......................................................................... 1303
26.1.6 USB Characteristics............................................................................................ 1303
26.1.7 Flash Memory Characteristics ............................................................................ 1304
26.2 Electrical Characteristics for H8S/2454 Group................................................................ 1306
26.2.1 Absolute Maximum Ratings ............................................................................... 1306
26.2.2 DC Characteristics .............................................................................................. 1307
26.2.3 AC Characteristics .............................................................................................. 1311
26.2.4 A/D Conversion Characteristics ......................................................................... 1319
26.2.5 D/A Conversion Characteristics ......................................................................... 1320
26.2.6 USB Characteristics............................................................................................ 1320
26.2.7 Flash Memory Characteristics ............................................................................ 1321
26.3 Timing Charts .................................................................................................................. 1323
26.3.1 Clock Timing ...................................................................................................... 1323
26.3.2 Control Signal Timing ........................................................................................ 1325
26.3.3 Bus Timing ......................................................................................................... 1326
26.3.4 DMAC and EXDMAC Timing........................................................................... 1344
26.3.5 USB Characteristics............................................................................................ 1350
26.3.6 Timing of On-Chip Peripheral Modules ............................................................. 1351
Appendix .......................................................................................................1359
A. Port States in Each Processing State................................................................................ 1359
B. Package Dimensions ........................................................................................................ 1378
C. Treatment of Unused Pins................................................................................................ 1382
Main Revisions and Additions in this Edition...................................................1385
Index .......................................................................................................1401