Technical information

106
3886 Group
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
MITSUBISHI MICROCOMPUTERS
PACKAGE OUTLINE
LQFP80-P-1212-0.5
Weight(g)
–
JEDEC Code
EIAJ Package Code
Lead Material
Cu Alloy
80P6Q-A
Plastic 80pin 12✕12mm body LQFP
–
0.1
–
––
0.2
–
–
––
–
–
––
–
Symbol
Min Nom Max
A
A
2
b
c
D
E
H
E
L
L
1
y
b
2
Dimension in Millimeters
H
D
A 1
0.225
––
I
2
1.0
––
M
D
12.4
––
M
E
12.4
10°0°
0.1
1.0
0.70.50.3
14.214.013.8
14.214.013.8
0.5
12.112.011.9
12.112.011.9
0.1750.1250.105
0.280.180.13
1.4
0
1.7
e
A
L
1
c
L
A
1
A
2
F
b
e
H D
E
H
E
D
1
20
21
40
41
60
61
80
M
E
b
2
l 2
M D
e
Recommended Mount Pad
Detail F
y
Weight(g)
JEDEC Code
EIAJ Package Code
80D0
Glass seal 80pin QFN
––
25
40
80
65
41
64
24
1
1.2TYP
0.6TYP0.8TYP
INDEX
1.78TYP
3.32MAX
0.8TYP
1.2TYP
0.8TYP0.5TYP
12.0±0.15
15.6±0.2
21.0±0.2 18.4±0.15