Datasheet
Table Of Contents
- Notes regarding these materials
- General Precautions in the Handling of MPU/MCU Products
- How to Use This Manual
- Table of Contents
- Quick Reference by Address B-
- 1. Overview
- 2. Central Processing Unit (CPU)
- 2.1 Data Registers (R0, R1, R2 and R3)
- 2.2 Address Registers (A0 and A1)
- 2.3 Frame Base Register (FB)
- 2.4 Interrupt Table Register (INTB)
- 2.5 Program Counter (PC)
- 2.6 User Stack Pointer (USP) and Interrupt Stack Pointer (ISP)
- 2.7 Static Base Register (SB)
- 2.8 Flag Register (FLG)
- 2.8.1 Carry Flag (C Flag)
- 2.8.2 Debug Flag (D Flag)
- 2.8.3 Zero Flag (Z Flag)
- 2.8.4 Sign Flag (S Flag)
- 2.8.5 Register Bank Select Flag (B Flag)
- 2.8.6 Overflow Flag (O Flag)
- 2.8.7 Interrupt Enable Flag (I Flag)
- 2.8.8 Stack Pointer Select Flag (U Flag)
- 2.8.9 Processor Interrupt Priority Level (IPL)
- 2.8.10 Reserved Area
- 3. Memory
- 4. Special Function Registers (SFRs)
- 5. Reset
- 6. Processor Mode
- 7. Clock Generation Circuit
- 8. Protection
- 9. Interrupt
- 10. Watchdog Timer
- 11. DMAC
- 12. Timer
- 13. Serial I/O
- 14. A/D Converter
- 15. CRC Calculation Circuit
- 16. Programmable I/O Ports
- 16.1 Port Pi Direction Register (PDi Register, i = 1, 6 to 10)
- 16.2 Port Pi Register (Pi Register, i = 1, 6 to 10)
- 16.3 Pull-up Control Register 0 to Pull-up Control Register 2 (PUR0 to PUR2 Registers)
- 16.4 Port Control Register
- 16.5 Pin Assignment Control register (PACR)
- 16.6 Digital Debounce function
- 17. Flash Memory Version
- 17.1 Flash Memory Performance
- 17.2 Memory Map
- 17.3 Functions To Prevent Flash Memory from Rewriting
- 17.4 CPU Rewrite Mode
- 17.5 Register Description
- 17.6 Precautions in CPU Rewrite Mode
- 17.6.1 Operation Speed
- 17.6.2 Prohibited Instructions
- 17.6.3 Interrupts
- 17.6.4 How to Access
- 17.6.5 Writing in the User ROM Space
- 17.6.6 DMA Transfer
- 17.6.7 Writing Command and Data
- 17.6.8 Wait Mode
- 17.6.9 Stop Mode
- 17.6.10 Low Power Consumption Mode and On-chip Oscillator-Low Power Consumption Mode
- 17.7 Software Commands
- 17.8 Status Register
- 17.9 Standard Serial I/O Mode
- 17.10 Parallel I/O Mode
- 18. Electrical Characteristics
- 19. Usage Notes
- 19.1 SFR
- 19.2 PLL Frequency Synthesizer
- 19.3 Power Control
- 19.4 Protect
- 19.5 Interrupts
- 19.6 DMAC
- 19.7 Timer
- 19.8 Serial I/O
- 19.9 A/D Converter
- 19.10 Programmable I/O Ports
- 19.11 Electric Characteristic Differences Between Mask ROM
- 19.12 Mask ROM Version
- 19.13 Flash Memory Version
- 19.13.1 Functions to Inhibit Rewriting Flash Memory
- 19.13.2 Stop mode
- 19.13.3 Wait mode
- 19.13.4 Low power dissipation mode, on-chip oscillator low power dissipation mode
- 19.13.5 Writing command and data
- 19.13.6 Program Command
- 19.13.7 Operation speed
- 19.13.8 Instructions prohibited in EW0 Mode
- 19.13.9 Interrupts
- 19.13.10 How to access
- 19.13.11 Writing in the user ROM area
- 19.13.12 DMA transfer
- 19.13.13 Regarding Programming/Erasure Times and Execution Time
- 19.13.14 Definition of Programming/Erasure Times
- 19.13.15 Flash Memory Version Electrical Characteristics 10,000 E/W cycle product
- 19.13.16 Boot Mode
- 19.14 Noise
- 19.15 Instruction for a Device Use
- Appendix 1. Package Dimensions
- Appendix 2. Functional Difference
- Register Index
- REVISION HISTORY
page 318
19. Usage Notes
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19.11 Electric Characteristic Differences Between Mask ROM and Flash Memory Ver-
sion Microcomputers
Flash memory version and mask ROM version may have different characteristics, operating margin, noise
tolerated dose, noise width dose in electrical characteristics due to internal ROM, different layout pattern,
etc. When switching to the mask ROM version, conduct equivalent tests as system evaluation tests con-
ducted in the flash memory version.