Technical information
Table Of Contents
- Cover
- Keep safety first in your circuit designs!
- Notes regarding these materials
- Preface
- Contents
- Section 1 Configuration
- Section 2 Connection Procedures
- Section 3 Installing the MCU to the User System
- Section 4 Verifying Operation
- Section 5 Notice
- Colophon
9
2.3 Recommended Dimensions for User System Mount Pad
Figure 5 shows the recommended dimensions for the mount pad (footprint) for the user system with
an IC socket for an FP-100M package (IC149-100-054-B51: manufactured by YAMAICHI
ELECTRONICS Co., Ltd.). Note that the dimensions in figure 5 are somewhat different from those
of the actual chip's mount pad.
Unit: mm
0.50 ± 0.05 0.30 ± 0.05
0.5 x 24 = 12.00 ± 0.05
0.5 x 24 = 12.00 ± 0.05
13.80 (max.)
17.10 (min.)
0.50 ± 0.05
Figure 5 Recommended Dimensions for Mount Pad