Technical information
Table Of Contents
- Preface
- Section 1 Configuration
- Section 2 Connection Procedures
- Section 3 Installing the MCU to the User System
- Section 4 Verifying Operation
- Section 5 Notice
2.3 Recommended Dimensions for User System Mount Pad
Figure 6 shows the recommended dimensions for the mount pad (footprint) for the user system with
an IC socket for an TFP-100G package (NQPACK100SE: manufactured by Tokyo Eletech
Corporation). Note that the dimensions in figure 6 are somewhat different from those of the actual
chip's mount pad.
Figure 6 Recommended Dimensions for Mount Pad
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