Technical information

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Chapter 5. Specifications
This chapter describes specifications of this product.
5.1 Specifications .............................................................................................................................. 52
5.2 Operation Timing in Memory Expansion Mode and Microprocessor Mode .............................. 53
(1) Separate Bus, No-wait .......................................................................................................... 53
(2) Separate Bus, With Wait, Accessing External Memory Area .............................................. 55
(3) Multiplex Bus, With Wait, Accessing External Memory Area ............................................ 57
(4) Timing Requirements ...........................................................................................................59
5.3 Electrical Characteristics ............................................................................................................. 61
5.4 Connection Diagram.................................................................................................................... 62
5.5 External Dimensions ................................................................................................................... 63
(1) External Dimensions of the Emulation Pod.......................................................................... 63
(2) External Dimensions of the Converter Board M3T-FLX-100LCC...................................... 64
(3) Reference Dimensional Drawing for 100-pin 0.65-mm-pitch QFP Foot Pattern................. 64